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Proceedings Paper

Liquid metal heat sink for high-power laser diodes
Author(s): John Vetrovec; Amardeep S. Litt; Drew A. Copeland; Jeremy Junghans; Roger Durkee
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Paper Abstract

We report on the development of a novel, ultra-low thermal resistance active heat sink (AHS) for thermal management of high-power laser diodes (HPLD) and other electronic and photonic components. AHS uses a liquid metal coolant flowing at high speed in a miniature closed and sealed loop. The liquid metal coolant receives waste heat from an HPLD at high flux and transfers it at much reduced flux to environment, primary coolant fluid, heat pipe, or structure. Liquid metal flow is maintained electromagnetically without any moving parts. Velocity of liquid metal flow can be controlled electronically, thus allowing for temperature control of HPLD wavelength. This feature also enables operation at a stable wavelength over a broad range of ambient conditions. Results from testing an HPLD cooled by AHS are presented.

Paper Details

Date Published: 26 February 2013
PDF: 7 pages
Proc. SPIE 8605, High-Power Diode Laser Technology and Applications XI, 86050E (26 February 2013); doi: 10.1117/12.2005357
Show Author Affiliations
John Vetrovec, Aqwest LLC (United States)
Amardeep S. Litt, Aqwest LLC (United States)
Drew A. Copeland, Aqwest LLC (United States)
Jeremy Junghans, Northrop Grumman Cutting Edge Optronics (United States)
Roger Durkee, Northrop Grumman Cutting Edge Optronics (United States)

Published in SPIE Proceedings Vol. 8605:
High-Power Diode Laser Technology and Applications XI
Mark S. Zediker, Editor(s)

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