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Proceedings Paper

Laser transfer of reconfigurable patterns with a spatial light modulator
Author(s): Alberto Piqué; Ray C. Y. Auyeung; Andrew T. Smith; Heungsoo Kim; Scott A. Mathews; Nicholas A. Charipar; Matthew A. Kirleis
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Paper Abstract

Laser forward transfer of arbitrary and complex configurable structures has recently been demonstrated using a spatial light modulator (SLM). The SLM allows the spatial distribution of the laser pulse, required by the laser transfer process, to be modified for each pulse. The programmable image on the SLM spatially modulates the intensity profile of the laser beam, which is then used to transfer a thin layer of material reproducing the same spatial pattern onto a substrate. The combination of laser direct write (LDW) with a SLM is unique since it enables LDW to operate not only in serial fashion like other direct write techniques but instead reach a level in parallel processing not possible with traditional digital fabrication methods. This paper describes the use of Digital Micromirror Devices or DMDs as SLMs in combination with visible (λ = 532 nm) nanosecond lasers. The parallel laser printing of arrayed structures with a single laser shot is demonstrated together with the full capabilities of SLMs for laser printing reconfigurable patterns of silver nano-inks Finally, an overview of the unique advantages and capabilities of laser forward transfer with SLMs is presented.

Paper Details

Date Published: 15 March 2013
PDF: 9 pages
Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 86080K (15 March 2013); doi: 10.1117/12.2005345
Show Author Affiliations
Alberto Piqué, U.S. Naval Research Lab. (United States)
Ray C. Y. Auyeung, U.S. Naval Research Lab. (United States)
Andrew T. Smith, Nova Research, Inc. (United States)
Heungsoo Kim, U.S. Naval Research Lab. (United States)
Scott A. Mathews, U.S. Naval Research Lab. (United States)
Nicholas A. Charipar, U.S. Naval Research Lab. (United States)
Matthew A. Kirleis, U.S. Naval Research Lab. (United States)


Published in SPIE Proceedings Vol. 8608:
Laser-based Micro- and Nanopackaging and Assembly VII
Udo Klotzbach; Yongfeng Lu; Kunihiko Washio, Editor(s)

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