
Proceedings Paper
Cellular scanning strategy for selective laser melting: evolution of optimal grid-based scanning path and parametric approach to thermal homogeneityFormat | Member Price | Non-Member Price |
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Paper Abstract
Selective laser melting, as a rapid manufacturing technology, is uniquely poised to enforce a paradigm shift in the manufacturing industry by eliminating the gap between job- and batch-production techniques. Products from this process, however, tend to show an increased amount of defects such as distortions, residual stresses and cracks; primarily attributed to the high temperatures and temperature gradients occurring during the process. A unit cell approach towards the building of a standard sample, based on literature, has been investigated in the present work. A pseudo-analytical model has been developed and validated using thermal distributions obtained using different existing scanning strategies. Several existing standard and non-standard scanning methods have been evaluated and compared using the empirical model as well as a 3D-thermal finite element model. Finally, a new grid-based scan strategy has been developed for processing the standard sample, one unit cell at a time, using genetic algorithms, with an objective of reducing thermal asymmetries.
Paper Details
Date Published: 15 March 2013
PDF: 13 pages
Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 86080M (15 March 2013); doi: 10.1117/12.2004256
Published in SPIE Proceedings Vol. 8608:
Laser-based Micro- and Nanopackaging and Assembly VII
Udo Klotzbach; Yongfeng Lu; Kunihiko Washio, Editor(s)
PDF: 13 pages
Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 86080M (15 March 2013); doi: 10.1117/12.2004256
Show Author Affiliations
Sankhya Mohanty, Technical Univ. of Denmark (Denmark)
Cem Celal Tutum, Technical Univ. of Denmark (Denmark)
Cem Celal Tutum, Technical Univ. of Denmark (Denmark)
Jesper Henri Hattel, Technical Univ. of Denmark (Denmark)
Published in SPIE Proceedings Vol. 8608:
Laser-based Micro- and Nanopackaging and Assembly VII
Udo Klotzbach; Yongfeng Lu; Kunihiko Washio, Editor(s)
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