Proceedings Paper
Laser scribing integration of polycrystalline thin film solar cells| Format | Member Price | Non-Member Price |
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Paper Abstract
The growing demand for high productivity in the thin-film photovoltaic module industry, together with the request for more and more efficient devices, needs high-performance laser-scribing. The results of scribing tests on CdTe and CIGS solar cells samples are here presented. A comparison between the scribes obtained with ns regime fiber lasers, and a ps regime diode pumped solid state laser will be also reported.
Paper Details
Date Published: 15 March 2013
PDF: 8 pages
Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 86080S (15 March 2013); doi: 10.1117/12.2003987
Published in SPIE Proceedings Vol. 8608:
Laser-based Micro- and Nanopackaging and Assembly VII
Udo Klotzbach; Yongfeng Lu; Kunihiko Washio, Editor(s)
PDF: 8 pages
Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 86080S (15 March 2013); doi: 10.1117/12.2003987
Show Author Affiliations
Michele Sozzi, Univ. degli Studi di Parma (Italy)
Filomena Manilia, Univ. degli Studi di Parma (Italy)
Roberto Antezza, Univ. degli Studi di Parma (Italy)
Cristina Catellani, Univ. degli Studi di Parma (Italy)
Alessandro Candiani, Univ. degli Studi di Parma (Italy)
Filomena Manilia, Univ. degli Studi di Parma (Italy)
Roberto Antezza, Univ. degli Studi di Parma (Italy)
Cristina Catellani, Univ. degli Studi di Parma (Italy)
Alessandro Candiani, Univ. degli Studi di Parma (Italy)
Enrico Coscelli, Univ. degli Studi di Parma (Italy)
Annamaria Cucinotta, Univ. degli Studi di Parma (Italy)
Stefano Selleri, Univ. degli Studi di Parma (Italy)
Daniele Menossi, Univ. degli Studi di Parma (Italy)
Alessio Bosio, Univ. degli Studi di Parma (Italy)
Annamaria Cucinotta, Univ. degli Studi di Parma (Italy)
Stefano Selleri, Univ. degli Studi di Parma (Italy)
Daniele Menossi, Univ. degli Studi di Parma (Italy)
Alessio Bosio, Univ. degli Studi di Parma (Italy)
Published in SPIE Proceedings Vol. 8608:
Laser-based Micro- and Nanopackaging and Assembly VII
Udo Klotzbach; Yongfeng Lu; Kunihiko Washio, Editor(s)
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