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Proceedings Paper

Low-loss high-speed silicon Mach-Zehnder modulator for optical-fiber telecommunications
Author(s): Kensuke Ogawa; Kazuhiro Goi; Hiroyuki Kusaka; Yoshihiro Terada; Tsung-Yang Liow; Xiaoguang Tu; Guo-Qiang Lo; Dim-Lee Kwong; Vivek Dixit; Soon Thor Lim; Ching Eng Png
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Paper Abstract

Low-loss high-speed traveling-wave silicon Mach-Zehnder modulator with reduced series resistance is studied in microwave and optical measurements. Microwave impedance and propagation loss under reverse bias are characterized by S-parameter measurements. Resonant loss due to series inductance-resistance-capacitance coupling limits microwave performances of the traveling-wave modulator. High-speed optical performances are characterized, based on eyediagram measurements in on-off keying at 10-32 Gb/s and constellation and eye-diagram measurements in differential phase-shift keying at 20 Gb/s. Dispersion tolerance in error-free transmission in 10-Gb/s on-off keying and 20-Gb/s differential phase-shift keying is obtained as +/-950 ps/nm and +/-220 ps/nm, respectively by path-penalty measurements. Transmission performance in 10-Gbps on-off keying is comparable with lithium niobate Mach-Zehnder modulator.

Paper Details

Date Published: 14 March 2013
PDF: 8 pages
Proc. SPIE 8629, Silicon Photonics VIII, 86290U (14 March 2013); doi: 10.1117/12.2002311
Show Author Affiliations
Kensuke Ogawa, Fujikura Ltd. (Japan)
Kazuhiro Goi, Fujikura Ltd. (Japan)
Hiroyuki Kusaka, Fujikura Ltd. (Japan)
Yoshihiro Terada, Fujikura Ltd. (Japan)
Tsung-Yang Liow, Institute of Microelectronics (Singapore)
Xiaoguang Tu, Institute of Microelectronics (Singapore)
Guo-Qiang Lo, Institute of Microelectronics (Singapore)
Dim-Lee Kwong, Institute of Microelectronics (Singapore)
Vivek Dixit, Institute of High Performance Computing (Singapore)
Soon Thor Lim, Institute of High Performance Computing (Singapore)
Ching Eng Png, Institute of High Performance Computing (Singapore)

Published in SPIE Proceedings Vol. 8629:
Silicon Photonics VIII
Joel Kubby; Graham T. Reed, Editor(s)

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