Proceedings Paper
Laser-bar stack using ELF heat-sinks mounted kinematically for double-sided cooling| Format | Member Price | Non-Member Price |
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Paper Abstract
We present a novel, high-power stack of 20% fill-factor, 976nm, laser-diode bars, each directly attached to an enhanced lateral-flow (ELF), copper-based, water-cooled heat-sink. The heat-sinks contain mounting screws that form a kinematic mount to minimize detrimental mechanical-stress on the diode bars while also providing beneficial, double-side cooling of the bars. A stack of 18-bars, emitting 2.54kW, was constructed to validate the technology. Using standard optics and a polarization multiplexer, a 320μm diameter, 0.3NA focus is achieved with a 6-bar stack that robustly couples 450W, with a ~67% coupling efficiency, from a passive, 400μm, 046NA doubleclad fiber.
Paper Details
Date Published: 26 February 2013
PDF: 8 pages
Proc. SPIE 8605, High-Power Diode Laser Technology and Applications XI, 86050P (26 February 2013); doi: 10.1117/12.2002230
Published in SPIE Proceedings Vol. 8605:
High-Power Diode Laser Technology and Applications XI
Mark S. Zediker, Editor(s)
PDF: 8 pages
Proc. SPIE 8605, High-Power Diode Laser Technology and Applications XI, 86050P (26 February 2013); doi: 10.1117/12.2002230
Show Author Affiliations
A. K. Chin, Somerville Laser Technology, LLC (United States)
J. G. Manni, JGM Associates, Inc. (United States)
R. H. Chin, Science Research Lab., Inc. (United States)
J. Levy, Northrop Grumman Cutting Edge Optronics (United States)
M. Dogan, Science Research Lab., Inc. (United States)
J. H. Jacob, Science Research Lab., Inc. (United States)
J. G. Manni, JGM Associates, Inc. (United States)
R. H. Chin, Science Research Lab., Inc. (United States)
J. Levy, Northrop Grumman Cutting Edge Optronics (United States)
M. Dogan, Science Research Lab., Inc. (United States)
J. H. Jacob, Science Research Lab., Inc. (United States)
R. Pathak, Coherent, Inc. (United States)
C. Wessling, INGENERIC GmbH (Germany)
K. D. Lang, Science Research Lab., Inc. (United States)
H. Eppich, Science Research Lab., Inc. (United States)
J. Fryer, Micro Cooling Concepts, Inc. (United States)
T. Haverkamp, INGENERIC GmbH (Germany)
C. Wessling, INGENERIC GmbH (Germany)
K. D. Lang, Science Research Lab., Inc. (United States)
H. Eppich, Science Research Lab., Inc. (United States)
J. Fryer, Micro Cooling Concepts, Inc. (United States)
T. Haverkamp, INGENERIC GmbH (Germany)
Published in SPIE Proceedings Vol. 8605:
High-Power Diode Laser Technology and Applications XI
Mark S. Zediker, Editor(s)
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