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Proceedings Paper

A no adhesive and temperature-insensitive package design of fiber Bragg grating pressure sensor
Author(s): Hui Wang; Jun Zhu; Hao Yin; Zhao Zhang; Haiyu Tang; Benli Yu
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Paper Abstract

In this study, an innovative temperature-insensitive and no adhesive package for FBG pressure sensor was designed. We presents an package construction to compensate for temperature deviation of a FBG by mechanical properties of different metal materials; the package realize no adhesive utilizing combined technique of electroless plating NI-P and electroplating NI and laser spot welding technology. On the basis of the study on the Material structural properties and the compensation principles analysis of the FBG, the finite element method is used to analysis of the feasibility of the construction and optimize the construction parameters. The results show that this compensation construction can effectively reduce the temperature sensitivity of the FBG.

Paper Details

Date Published: 27 November 2012
PDF: 8 pages
Proc. SPIE 8555, Optoelectronic Devices and Integration IV, 85551A (27 November 2012); doi: 10.1117/12.2000681
Show Author Affiliations
Hui Wang, Anhui Univ. (China)
Jun Zhu, Anhui Univ. (China)
Hao Yin, Anhui Univ. (China)
Zhao Zhang, Anhui Univ. (China)
Haiyu Tang, Anhui Univ. (China)
Benli Yu, Anhui Univ. (China)

Published in SPIE Proceedings Vol. 8555:
Optoelectronic Devices and Integration IV
Xuping Zhang; Hai Ming; Joel M. Therrien, Editor(s)

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