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Proceedings Paper

Variable parameters for bonding heat seal connectors to flat panel displays
Author(s): James R. Bouldin; Roger R. Reinke
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Paper Abstract

This paper reports on a study of the three basic parameters involved in bonding heat seal connectors to flat panel displays. Those parameters are: temperature. at the bond, pressure at the bond, and the time that the temperature and pressure are applied to the bond.

Paper Details

Date Published: 1 April 1990
PDF: 8 pages
Proc. SPIE 1257, Liquid Crystal Displays and Applications, (1 April 1990); doi: 10.1117/12.19936
Show Author Affiliations
James R. Bouldin, Elform, Inc. (United States)
Roger R. Reinke, Elform, Inc. (United States)

Published in SPIE Proceedings Vol. 1257:
Liquid Crystal Displays and Applications
J. William Doane; Zvi Yaniv, Editor(s)

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