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Proceedings Paper

Micromachined silicon x-ray optics
Author(s): Andrew W. Chen; Philip E. Kaaret; Thomas W. Kenny
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Paper Abstract

We employed anisotropic etching of single crystal silicon wafers for the fabrication of micron- scale optical elements. We have succeeded in producing silicon lenses with a geometry suitable for 1-d focusing x-ray optics. These lenses have an aspect ratio (40:1) suitable for x- ray reflection and have very good optical surface alignment. We have developed a number of process refinements which improved the quality of the lens geometry and the repeatability of the etch process. A significant progress was made in obtaining good optical surface quality. The RMS roughness was decreased from 110 angstroms for our initial lenses to 30 angstroms in the final lenses. A further factor of three improvement in surface quality is required for the production of efficiency x-ray optics. We present new wafer geometries designed to test the effect of the etch process on surface roughness.

Paper Details

Date Published: 11 November 1994
PDF: 7 pages
Proc. SPIE 2279, Advances in Multilayer and Grazing Incidence X-Ray/EUV/FUV Optics, (11 November 1994); doi: 10.1117/12.193147
Show Author Affiliations
Andrew W. Chen, Columbia Univ. (United States)
Philip E. Kaaret, Columbia Univ. (United States)
Thomas W. Kenny, Stanford Univ. (United States)

Published in SPIE Proceedings Vol. 2279:
Advances in Multilayer and Grazing Incidence X-Ray/EUV/FUV Optics
Richard B. Hoover; Arthur B. C. Walker Jr., Editor(s)

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