This paper describes research into a high speed image processing system using parallel digital signal processors for the processing of electro-optic images. The objective of the system is to reduce the processing time of non-contact type inspection problems including industrial and medical applications. A single processor can not deliver sufficient processing power required for the use of applications hence, a MIMD system is designed and constructed to enable fast processing of electro-optic images. The Texas Instruments TMS320C40 digital signal processor is used due to its high speed floating point CPU and the support for the parallel processing environment. A custom designed VISION bus is provided to transfer images between processors. The system is being applied for solder joint inspection of high technology printed circuit boards.

Date Published: 28 October 1994
PDF: 11 pages
Proc. SPIE 2296, Advanced Signal Processing: Algorithms, Architectures, and Implementations V, (28 October 1994); doi: 10.1117/12.190876

Published in SPIE Proceedings Vol. 2296:
Advanced Signal Processing: Algorithms, Architectures, and Implementations V
Franklin T. Luk, Editor(s)