This paper describes a SIMM (Single Inline Memory Module) inspection system called SIMMI. The system inspects the front 'C-Gap' of the SIMMS and the back 'True Position' of the solder tails at 1.07 seconds/connector using 3 synchronized shuttered cameras with Telecentric Optics. This system is a very high speed (75 frames/second) inspection system designed from off-the-shelf hardware for inspecting SIMMs to a high degree of accuracy (< 4 micron repeatability). The system used standard linear and area techniques to process 700 measurements/second on an EISA based framestore hosted in 486 based PC. The paper will describe the system, and the techniques which were used to test and debug the system, which is not a trivial problem when the system is processing 75 frames/second. In particular, the paper will describe the techniques used to synchronize the camera and SIMM driver mechanics and the evolution of the lighting techniques.

Date Published: 3 October 1994
PDF: 11 pages
Proc. SPIE 2347, Machine Vision Applications, Architectures, and Systems Integration III, (3 October 1994); doi: 10.1117/12.188743

Published in SPIE Proceedings Vol. 2347:
Machine Vision Applications, Architectures, and Systems Integration III
Bruce G. Batchelor; Susan Snell Solomon; Frederick M. Waltz, Editor(s)