Share Email Print

Proceedings Paper

Integrated TCAD for OEIC applications
Author(s): Robert W. Dutton; Francis M. Rotella; Zak Sahul; L. So; Zhiping Yu
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Progress in technology CAD (TCAD) tools that span the range of IC circuit design, semiconductor device modeling, and material processing simulation is discussed. Special emphasis is given to the application in the optoelectronic devices and systems. Promising techniques for the mixed device/circuit simulation are presented, using UC Berkeley's SPICE and Stanford's PISCES programs. Results show the capability to optimize the circuit timing and impedances to match the internal physical effects and the resulting optical properties in AlGaAs based LEDs. 3D solid modeling, a new approach for interactive device design based on the mask layout information, is discussed. Automatic gridding to support a unified process/device modeling capability for GaAs structures using SUPREM-IV.GS is also introduced. Taken as a whole, the unification of these TCAD tools provides a powerful design approach for the world of the optoelectronic ICs (OEIC).

Paper Details

Date Published: 30 June 1994
PDF: 10 pages
Proc. SPIE 2146, Physics and Simulation of Optoelectronic Devices II, (30 June 1994); doi: 10.1117/12.178499
Show Author Affiliations
Robert W. Dutton, Stanford Univ. (United States)
Francis M. Rotella, Stanford Univ. (United States)
Zak Sahul, Stanford Univ. (United States)
L. So, Stanford Univ. (United States)
Zhiping Yu, Stanford Univ. (United States)

Published in SPIE Proceedings Vol. 2146:
Physics and Simulation of Optoelectronic Devices II
Weng W. Chow; Marek Osinski, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?