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Proceedings Paper

Reticle metrology requirements: systems and methods
Author(s): Scott Landstrom; Bert F. Plambeck
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Paper Abstract

As leading edge semiconductor devices design rules continue their downward migration, the required reticle manufacturing tolerances continue tightening. In particular, as CD and registration specifications shrink, the metrology system's precision and accuracy used to measure reticle parameters becomes increasingly important. Additionally, as advanced reticle design tolerances tighten, the sample size needed to obtain the same level of confidence to be certain a given reticle meets specification also rises. Consequently, with shrinking tolerances and escalating sample sizes required to manufacture leading edge reticles, metrology is a key area requiring dramatic improvement in the 90's. A brief review of specification trends, metrology statistics, and the mask making equipment needed to meet such requirements is presented.

Paper Details

Date Published: 1 January 1994
PDF: 24 pages
Proc. SPIE 10273, 64-to 256-Megabit Reticle Generation: Technology Requirements and Approaches: A Critical Review, 102730B (1 January 1994); doi: 10.1117/12.177431
Show Author Affiliations
Scott Landstrom, SiScan Systems, Inc. (United States)
Bert F. Plambeck, SiScan Systems, Inc. (United States)


Published in SPIE Proceedings Vol. 10273:
64-to 256-Megabit Reticle Generation: Technology Requirements and Approaches: A Critical Review
Gregory K. Hearn, Editor(s)

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