Share Email Print

Proceedings Paper

Vertical-cavity surface-emitting lasers for flip-chip packaged vertical optical interconnects
Author(s): Sean S. O'Keefe; William J. Schaff; Lester Fuess Eastman
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Vertical cavity surface emitting lasers (VCSELs) have been fabricated and studied as the optical sources in a vertical optical interconnect application. The VCSELs are to replace LEDs that are currently used in a proof-of-concept demonstration. The advantages of VCSELs ares better power efficiency as sources, higher optical powers, focused beam output, monochromatic operation, and higher modulation bandwidth. The VCSELs used in this project are the first to implement continuously sinusoidally graded interface mirrors grown by molecular beam epitaxy. material parameters, device results, and interconnect implications are presented.

Paper Details

Date Published: 3 June 1994
PDF: 8 pages
Proc. SPIE 2216, Photonics at the Air Force Photonics Center, (3 June 1994); doi: 10.1117/12.177330
Show Author Affiliations
Sean S. O'Keefe, Cornell Univ. (United States)
William J. Schaff, Cornell Univ. (United States)
Lester Fuess Eastman, Cornell Univ. (United States)

Published in SPIE Proceedings Vol. 2216:
Photonics at the Air Force Photonics Center
Andrew R. Pirich; Paul Sierak, Editor(s)

© SPIE. Terms of Use
Back to Top