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Proceedings Paper

Bonding layer effects on the actuation mechanism of an induced strain actuator/substructure system
Author(s): Mark W. Lin; Craig A. Rogers
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Paper Abstract

An integrated induced-strain actuator/substructure system requires a third-phase adhesive layer to provide bond between the adherends. The presence of the adhesive, which in general has relatively low stiffness and strength, brings about concern regarding losses in transferring the actuation mechanism from the actuator to the substructure and bonding failure regarding structural integrity. In this paper, an analytical model for an integrated actuator/adhesive/substructure system is developed to study the adhesive layer effects. The model is formulated on the basis of the theory of elasticity and solved by the principle of stationary complementary energy. The solution obtained is, in an approximate manner, in closed form. The results show that a relatively thick and/or compliant adhesive causes noticeable losses in the transfer of the actuation mechanism, particularly in the end zone near the actuator edges. Nevertheless, such an adhesive yields low interfacial shear and peeling stresses which are beneficial to the structural integrity.

Paper Details

Date Published: 6 May 1994
PDF: 13 pages
Proc. SPIE 2190, Smart Structures and Materials 1994: Smart Structures and Intelligent Systems, (6 May 1994); doi: 10.1117/12.175221
Show Author Affiliations
Mark W. Lin, Virginia Polytechnic Institute and State Univ. (United States)
Craig A. Rogers, Virginia Polytechnic Institute and State Univ. (United States)

Published in SPIE Proceedings Vol. 2190:
Smart Structures and Materials 1994: Smart Structures and Intelligent Systems
Nesbitt W. Hagood, Editor(s)

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