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Proceedings Paper

Optically interconnected multichip module based on computer-generated holograms and flip-chip technology
Author(s): Michael R. Feldman; Waddie Heyward; Paul A. Magill; Hedong Yang; James E. Morris
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Paper Abstract

For the past few years we have been working on the development of an optically interconnected multichip module (MCM). The MCM is composed of a planar transparent substrate, containing thin film electrical connections. GaAs laser array chips and silicon CMOS VLSI chips with integrated photodetectors are flip-chip bonded to one side of the substrate, while computer generated holograms (CGHs) are fabricated on the other side of the substrate. The purpose of this work is to develop the technology to enable high speed and high density connections between chips, MCMs, and PC boards. We believe that the basic approach we use, based on flip-chip and CGH technology, will provide 1-2 orders of magnitude increase in connection performance when compared with conventional electrical connectors.

Paper Details

Date Published: 2 May 1994
PDF: 9 pages
Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); doi: 10.1117/12.174533
Show Author Affiliations
Michael R. Feldman, Univ. of North Carolina/Charlotte (United States)
Waddie Heyward, Univ. of North Carolina/Charlotte (United States)
Paul A. Magill, MCNC Ctr. for Microelectronics (United States)
Hedong Yang, Univ. of North Carolina/Charlotte (United States)
James E. Morris, Univ. of North Carolina/Charlotte (United States)

Published in SPIE Proceedings Vol. 2153:
Optoelectronic Interconnects II
Ray T. Chen; John A. Neff, Editor(s)

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