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Proceedings Paper

Planned development of a 3D computer based on free-space optical interconnects
Author(s): John A. Neff; David R. Guarino
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Paper Abstract

Free-space optical interconnection has the potential to provide upwards of a million data channels between planes of electronic circuits. This may result in the planar board and backplane structures of today giving away to 3-D stacks of wafers or multi-chip modules interconnected via channels running perpendicular to the processor planes, thereby eliminating much of the packaging overhead. Three-dimensional packaging is very appealing for tightly coupled fine-grained parallel computing where the need for massive numbers of interconnections is severely taxing the capabilities of the planar structures. This paper describes a coordinated effort by four research organizations to demonstrate an operational fine-grained parallel computer that achieves global connectivity through the use of free space optical interconnects.

Paper Details

Date Published: 2 May 1994
PDF: 8 pages
Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); doi: 10.1117/12.174520
Show Author Affiliations
John A. Neff, Univ. of Colorado/Boulder (United States)
David R. Guarino, Science Applications International Corp. (United States)

Published in SPIE Proceedings Vol. 2153:
Optoelectronic Interconnects II
Ray T. Chen; John A. Neff, Editor(s)

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