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Proceedings Paper

Design considerations for high packaging density optical bus array
Author(s): Suning Tang; Ray T. Chen; David J. Gerold; Maggie M. Li; Srikanth Natarajan; Jengping Lin; N. Chellappan; Mark A. Peskin
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Paper Abstract

In this paper, a crosstalk model is developed to study the packing density and interconnect distance limitations of an optical interconnect system employing polymer-based single-mode bus arrays. The upper limit of channel packing density (1250 channels/cm at interconnect distance of 5 cm) is determined for the first time using the crosstalk model, in which channel cross-coupling among an infinite number of waveguides is considered. Computer simulations are provided together with the proven experimental results. It is shown that there is a threshold of channel separation due to channel cross-coupling, which results in a tradeoff between channel packing density and interconnect distance. Waveguide dimension closer to the cutoff boundary of second mode (E12X) is preferred for an optimum design.

Paper Details

Date Published: 2 May 1994
PDF: 9 pages
Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); doi: 10.1117/12.174511
Show Author Affiliations
Suning Tang, Univ. of Texas/Austin (United States)
Ray T. Chen, Univ. of Texas/Austin (United States)
David J. Gerold, Univ. of Texas/Austin (United States)
Maggie M. Li, Univ. of Texas/Austin (United States)
Srikanth Natarajan, Univ. of Texas/Austin (United States)
Jengping Lin, Univ. of Texas/Austin (United States)
N. Chellappan, Univ. of Texas/Austin (United States)
Mark A. Peskin, Univ. of Texas/Austin (United States)

Published in SPIE Proceedings Vol. 2153:
Optoelectronic Interconnects II
Ray T. Chen; John A. Neff, Editor(s)

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