Proceedings PaperHolographic interferometry applied to the characterization and analysis of the dynamic and modal behavior of complex circuit board structures
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Holographic Interferometry has been successfully employed to characterize and test the behavior of diverse types of structures under stress. Such applications of holographic technique have proven to be among the most effective methods of modal and dynamic analysis available. The technology is non-destructive, real-time, and definitive in allowing the identification of vibrational modes, displacements, and motion geometry. Structures can be analyzed with very low amplitude excitation and the resultant data can be used to adjust the accuracy of mathematically derived structural models. Holographic methods have offered a powerful tool to aid in the primary engineering and development of complex circuit board assemblies which are used in highly mobile platforms. Avionic, undersea, and even automotive systems involve applications where the environment presents large vibrations and stresses which can affect operation and structural stability. These are ideal requisites for analysis using advanced time-average holographic methods in the initial engineering of such advanced systems.