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Proceedings Paper

Ion beam milling of thin films for optical fabrication
Author(s): Charles M. Egert
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Paper Abstract

The work reported here examines the roughness evolution of several thin films including gold, copper, aluminum and silicon; all applied to fused silica substrates. The films were deposited by an ion beam sputtering process and ranged in thickness from a few hundred nanometers to several micrometers. Roughness evolution during ion milling was evaluated by exposing the thin films to an argon ion beam and measuring roughness at regular intervals until the thin film was completely removed. These results suggest that roughness evolution depends on initial film roughness as well as depth of material removed.

Paper Details

Date Published: 1 February 1994
PDF: 6 pages
Proc. SPIE 1994, Advanced Optical Manufacturing and Testing IV, (1 February 1994); doi: 10.1117/12.167954
Show Author Affiliations
Charles M. Egert, Oak Ridge National Lab. (United States)

Published in SPIE Proceedings Vol. 1994:
Advanced Optical Manufacturing and Testing IV
Victor J. Doherty D.V.M., Editor(s)

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