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Proceedings Paper

Excimer laser ablation of contaminated polyimide
Author(s): Gouri Radhakrishnan
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Paper Abstract

Excimer laser ablation is used as an effective surface cleaning technique for polyimide layers used in electronic packaging applications. Experiments are reported at 193 nm and 248 nm. At each of these wavelengths, ablations of the contaminated polyimide surface were carried out as a function of incident laser fluence. Quantitative determinations of contaminants present in the polyimide were made using surface analytical techniques. It is clearly demonstrated that excimer laser radiation at both 193 and 248 nm can be used to selectively remove trace metal contaminants from polyimide surfaces leaving intact the fine-line metallizations patterned on them. However, differences in the ablation thresholds, as well as in the ablation rates, are observed at these two wavelengths.

Paper Details

Date Published: 1 February 1994
PDF: 7 pages
Proc. SPIE 2045, Laser-Assisted Fabrication of Thin Films and Microstructures, (1 February 1994); doi: 10.1117/12.167578
Show Author Affiliations
Gouri Radhakrishnan, The Aerospace Corp. (United States)

Published in SPIE Proceedings Vol. 2045:
Laser-Assisted Fabrication of Thin Films and Microstructures
Ian W. Boyd, Editor(s)

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