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Proceedings Paper

Laser processing of palladium for selective electroless copper plating
Author(s): Marie-Helene Bernier; Ricardo Izquierdo; Michel Meunier
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Paper Abstract

Various methods for laser-assisted activation of dielectric layers for selective electroless copper plating are investigated. The direct writing of palladium feature by the Ar+ laser-induced pyrolytic decomposition of an organometallic palladium resin on polyimide and Si3N4 leads to active Pd sites which are selectively copper plated. Other laser-induced processes for selective palladium seeding are studied. It is also shown that those are efficient seeding processes for the electroless plating of copper.

Paper Details

Date Published: 1 February 1994
PDF: 8 pages
Proc. SPIE 2045, Laser-Assisted Fabrication of Thin Films and Microstructures, (1 February 1994); doi: 10.1117/12.167577
Show Author Affiliations
Marie-Helene Bernier, Ecole Polytechnique de Montreal (Canada)
Ricardo Izquierdo, Ecole Polytechnique de Montreal (Canada)
Michel Meunier, Ecole Polytechnique de Montreal (Canada)

Published in SPIE Proceedings Vol. 2045:
Laser-Assisted Fabrication of Thin Films and Microstructures
Ian W. Boyd, Editor(s)

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