Various methods for laser-assisted activation of dielectric layers for selective electroless copper plating are investigated. The direct writing of palladium feature by the Ar⁺ laser-induced pyrolytic decomposition of an organometallic palladium resin on polyimide and Si₃N₄ leads to active Pd sites which are selectively copper plated. Other laser-induced processes for selective palladium seeding are studied. It is also shown that those are efficient seeding processes for the electroless plating of copper.

Date Published: 1 February 1994
PDF: 8 pages
Proc. SPIE 2045, Laser-Assisted Fabrication of Thin Films and Microstructures, (1 February 1994); doi: 10.1117/12.167577

Published in SPIE Proceedings Vol. 2045:
Laser-Assisted Fabrication of Thin Films and Microstructures
Ian W. Boyd, Editor(s)