
Proceedings Paper
Laser processing of palladium for selective electroless copper platingFormat | Member Price | Non-Member Price |
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Paper Abstract
Various methods for laser-assisted activation of dielectric layers for selective electroless copper plating are investigated. The direct writing of palladium feature by the Ar+ laser-induced pyrolytic decomposition of an organometallic palladium resin on polyimide and Si3N4 leads to active Pd sites which are selectively copper plated. Other laser-induced processes for selective palladium seeding are studied. It is also shown that those are efficient seeding processes for the electroless plating of copper.
Paper Details
Date Published: 1 February 1994
PDF: 8 pages
Proc. SPIE 2045, Laser-Assisted Fabrication of Thin Films and Microstructures, (1 February 1994); doi: 10.1117/12.167577
Published in SPIE Proceedings Vol. 2045:
Laser-Assisted Fabrication of Thin Films and Microstructures
Ian W. Boyd, Editor(s)
PDF: 8 pages
Proc. SPIE 2045, Laser-Assisted Fabrication of Thin Films and Microstructures, (1 February 1994); doi: 10.1117/12.167577
Show Author Affiliations
Marie-Helene Bernier, Ecole Polytechnique de Montreal (Canada)
Ricardo Izquierdo, Ecole Polytechnique de Montreal (Canada)
Ricardo Izquierdo, Ecole Polytechnique de Montreal (Canada)
Michel Meunier, Ecole Polytechnique de Montreal (Canada)
Published in SPIE Proceedings Vol. 2045:
Laser-Assisted Fabrication of Thin Films and Microstructures
Ian W. Boyd, Editor(s)
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