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Proceedings Paper

Flexure of photomasks in manufacturing and application
Author(s): Michael Zander
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Paper Abstract

The actual photomask surface formation during all relevant stages of manufacturing and application generally is determined by substrate flatness, stress introduced by the coating layers and, in particular, by gravity bending determined by substrate dimensions and actual clamping configuration. Dependant on the source of surface deformation, the actual pattern positions may vary in different ways compared to the design and lead to a registration error of up to 0.1 micrometers . Approaching these problems from the mask metrology point of view this paper presents a study based on modelling and experimental verification utilizing the Z- mapping feature of Nikon XY 3I mask metrology tool. The two error types, cosine error and pattern shift by lateral surface compression or stretching, will be calculated for two basic clamping configurations. Derived from the results and under consideration of current flexure compensation schemes the impact on the printed wafer image will be estimated leading to a discussion of possible correction schemes.

Paper Details

Date Published: 15 February 1994
PDF: 12 pages
Proc. SPIE 2087, 13th Annual BACUS Symposium on Photomask Technology and Management, (15 February 1994); doi: 10.1117/12.167285
Show Author Affiliations
Michael Zander, DuPont Photomasks (Germany)

Published in SPIE Proceedings Vol. 2087:
13th Annual BACUS Symposium on Photomask Technology and Management
Edward C. Grady; Jack P. Moneta, Editor(s)

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