Share Email Print

Proceedings Paper

Dynamic response of mode III interface crack in bonded materials
Author(s): Ya-Pu Zhao; Jing Fang
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

This paper concerns the problems of dynamic response of the semi-infinite stationary mode III cracks in bonded materials subjected to dynamic load. Two kinds of semi-infinite cracks are considered that either lies along or perpendicularly terminates the interface of two half-plane dissimilar materials perfectly bonded together. The stress fields near the crack tips are analyzed in which the propagations of the different stress waves are illustrated. The results show that the standard square root singularity of stress distribution is valid for the interface crack but untenable for the crack perpendicular to the interface.

Paper Details

Date Published: 27 September 1993
PDF: 6 pages
Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); doi: 10.1117/12.158605
Show Author Affiliations
Ya-Pu Zhao, Peking Univ. (China)
Jing Fang, Peking Univ. (China)

Published in SPIE Proceedings Vol. 1999:
Adhesives Engineering
Eric A. Norland; Kenneth M. Liechti, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?