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Proceedings Paper

Positive chemically amplified resist for deep-UV lithography
Author(s): Omkaram Nalamasu; Allen G. Timko; May Cheng; Janet M. Kometani; Mary E. Galvin-Donoghue; Sharon A. Heffner; Sydney G. Slater; Andrew J. Blakeney; Norbert Muenzel; Reinhard Schulz; Heinz E. Holzwarth; Carlo Mertesdorf; Hans-Thomas Schacht
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Paper Abstract

A novel approach to chemically amplified resists based on the `base cleavage' mechanism where t-boc groups serve as the imaging units and acetoxy functionalities provide solubility differential between the exposed and unexposed resist areas was realized with poly(4- acetoxystyrene-4-t-butoxycarbonyloxystyrene sulfone, PASTBSS) terpolymer based resist formulations. The acidolytic cleavage of t-boc groups occurs in both the poly(4- acetoxystyrene-4-t-butoxycarbonyloxystyrene, PASTBS) copolymer and poly(4- acetoxystyrene-4-t-butoxycarbonyloxystyrene sulfone, PASTBSS) terpolymer resist formulations but the base induced acetyl removal occurs in the solid state (in the film) only in the PASTBSS resists, indicating the need for sulfur dioxide in the polymer backbone. Not surprisingly, acetoxy groups can be removed in solution from both PASTBS and PASTBSS polymers or their t-boc deprotected analogs.

Paper Details

Date Published: 15 September 1993
PDF: 12 pages
Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); doi: 10.1117/12.154748
Show Author Affiliations
Omkaram Nalamasu, AT&T Bell Labs. (United States)
Allen G. Timko, AT&T Bell Labs. (United States)
May Cheng, AT&T Bell Labs. (United States)
Janet M. Kometani, AT&T Bell Labs. (United States)
Mary E. Galvin-Donoghue, AT&T Bell Labs. (United States)
Sharon A. Heffner, AT&T Bell Labs. (United States)
Sydney G. Slater, OCG Microelectronic Materials, Inc. (United States)
Andrew J. Blakeney, OCG Microelectronic Materials, Inc. (United States)
Norbert Muenzel, OCG Microelectronic Materials AG (Switzerland)
Reinhard Schulz, OCG Microelectronic Materials AG (Switzerland)
Heinz E. Holzwarth, OCG Microelectronic Materials AG (Switzerland)
Carlo Mertesdorf, OCG Microelectronic Materials AG (Switzerland)
Hans-Thomas Schacht, OCG Microelectronic Materials AG (Switzerland)

Published in SPIE Proceedings Vol. 1925:
Advances in Resist Technology and Processing X
William D. Hinsberg, Editor(s)

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