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Proceedings Paper

Commercial CMOS foundry thermal display for dynamic thermal scene simulation
Author(s): Michael Gaitan; M. Parameswaran; R. Barry Johnson; Ronald Chung
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Paper Abstract

We report on the performance of a flat-panel thermal display technology, prototype developed at NIST in collaboration with Simon Fraser University and Optical E. T. C., for dynamic thermal scene simulation (DTSS). The pixel elements of the display are composed of thermally-isolated resistive heaters. The main innovation is the fabrication method which uses commercial CMOS integrated circuit (IC) foundries. This method produces a low- manufacturing-cost, high-yield, thermal display technology. Circuits for drive and control are monolithically integrated on the display. The microheating element has a thermal time constant of a few milliseconds and a temperature range of operation from ambient to over 1000 degree(s)C. A 16 X 16 pixel array with a 0.2 mm pixel pitch is presented as a demonstration of the concept; however, the circuit design supports larger sizes (e.g., 256 X $256). This display technology is compatible with DTSS requirements for laboratory and fieldable built-in test/built-in test equipment (BIT/BITE) applications.

Paper Details

Date Published: 31 August 1993
PDF: 7 pages
Proc. SPIE 1969, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing IV, (31 August 1993); doi: 10.1117/12.154731
Show Author Affiliations
Michael Gaitan, National Institute of Standards and Technology (United States)
M. Parameswaran, Simon Fraser Univ. (Canada)
R. Barry Johnson, Optical E.T.C., Inc. (United States)
Ronald Chung, Optical E.T.C., Inc. (United States)

Published in SPIE Proceedings Vol. 1969:
Infrared Imaging Systems: Design, Analysis, Modeling, and Testing IV
Gerald C. Holst, Editor(s)

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