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Proceedings Paper

Flexible multisensor inspection system for solder-joint analysis
Author(s): Gerard Lacey; Ronan Waldron; Jean-Marc Dinten; Francis Lilley
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Paper Abstract

This paper describes the design and construction of an open, automated, solder bond verification machine for the electronics manufacturing industry. The application domain is the higher end assembly technologies, with an emphasis on fine pitch surface mount components. The system serves a measurement function, quantifying the solder bonds. It interfaces with the manufacturing process to close the manufacturing loop. A geometric model of the solder in a joint, coupled with a finite element analysis of the physical properties of solder, lead to objective measurement of the solder. Principle illumination systems are laser, X-ray and noncoherent lighting. Open, Objected Oriented design and implementation practices enable a forward looking system to be developed.

Paper Details

Date Published: 6 August 1993
PDF: 13 pages
Proc. SPIE 2064, Machine Vision Applications, Architectures, and Systems Integration II, (6 August 1993); doi: 10.1117/12.150293
Show Author Affiliations
Gerard Lacey, Trinity College Dublin (Ireland)
Ronan Waldron, Trinity College Dublin (Ireland)
Jean-Marc Dinten, LETI-CEA Technologies Advancees (France)
Francis Lilley, Liverpool John Moores Univ. (United Kingdom)

Published in SPIE Proceedings Vol. 2064:
Machine Vision Applications, Architectures, and Systems Integration II
Bruce G. Batchelor; Susan Snell Solomon; Frederick M. Waltz, Editor(s)

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