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Proceedings Paper

Characterization of stepper chuck performance
Author(s): Randal K. Goodall; Frances P. Alvarez
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Paper Abstract

A new metrology method is described which is capable of extracting information about the flatness and performance of the vacuum chuck which holds the wafer in a photolithographic stepper. The method is based on a comparison of the wafer flatness as measured by the stepper and the wafer flatness as measured by a thickness-based flatness metrology system. The flatness datamaps for one wafer are subtracted using ensemble mathematics to yield a stepper chuck signature datamap. Signatures for several wafers are ensemble averaged to test for statistical validity. Stepper and flatness metrology data as well as statistical signatures are presented. Wafer and operational dependencies are discussed. The signature has potential use in the tracking of chuck wear and the feeding forward of flatness information to stepper control systems.

Paper Details

Date Published: 4 August 1993
PDF: 13 pages
Proc. SPIE 1926, Integrated Circuit Metrology, Inspection, and Process Control VII, (4 August 1993); doi: 10.1117/12.148940
Show Author Affiliations
Randal K. Goodall, ADE Corp. (United States)
Frances P. Alvarez, ADE Corp. (United States)

Published in SPIE Proceedings Vol. 1926:
Integrated Circuit Metrology, Inspection, and Process Control VII
Michael T. Postek, Editor(s)

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