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Proceedings Paper

Excimer laser as a source for thin Cu film deposition for use in electronic device fabrication
Author(s): Alvin Sugerman; Bodil Braren; Frank Turene; W. Wajda
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Paper Abstract

Investigations are carried out to characterize Cu deposition from a solid target using a XeCl, 28 ns pulse width, excimer laser at energies between 2 - 15 J/cm2. Scanning electron microscope (SEM) studies of the target surface revealed sputtering effects, droplet formation and surface waves. Density per unit substrate area of droplet-like-Cu particles transferred from the target is a function of frequency, deposition time, state of the target surface and power density. Mass and charge collected at the substrate are obtained as a function of distance to the target. Mass deposition as a variation of laser beam to target angle, facetting angle at feature edges and grain size as a function of substrate bias were measured. Fill shape evolution of micron size holes are obtained. An energy threshold for Cu-ion generation is extrapolated from the measured ion current vs. energy in.

Paper Details

Date Published: 24 June 1993
PDF: 15 pages
Proc. SPIE 1856, Laser Radiation Photophysics, (24 June 1993); doi: 10.1117/12.147624
Show Author Affiliations
Alvin Sugerman, IBM Thomas J. Watson Research Ctr. (United States)
Bodil Braren, IBM Thomas J. Watson Research Ctr. (United States)
Frank Turene, IBM Corp. (United States)
W. Wajda, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 1856:
Laser Radiation Photophysics
Bodil Braren; Mikhail N. Libenson, Editor(s)

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