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Proceedings Paper

Improving wire-bond quality on multichip modules through reduction of polyimide ablation debris
Author(s): Daniel G. Patterson; Michael Doscher; Robert Gephard
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Paper Abstract

Ablation of polyimide with a XeCl excimer laser produces deposits of soot-like debris that can alter the surface properties of adjacent structures. In this case, debris accumulation degraded the quality of ultrasonic wire bonding to contaminated bond pads. The addition of flowing helium during the ablation process visibly reduced the debris accumulation and improved subsequent wire bonding. The quality of wire bonding was then used to measure the relative importance of ablation process parameters in the reduction of debris.

Paper Details

Date Published: 24 June 1993
PDF: 7 pages
Proc. SPIE 1856, Laser Radiation Photophysics, (24 June 1993); doi: 10.1117/12.147612
Show Author Affiliations
Daniel G. Patterson, IBM Corp. (United States)
Michael Doscher, IBM Corp. (United States)
Robert Gephard, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 1856:
Laser Radiation Photophysics
Bodil Braren; Mikhail N. Libenson, Editor(s)

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