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Proceedings Paper

Progress and status of guided-wave optical interconnection technology
Author(s): Julian P. G. Bristow; Charles T. Sullivan; Sayan D. Mukherjee; Yue Liu; Anis Husain
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Paper Abstract

Optical interconnects at the cabinet-to-cabinet, board-to-board, and multichip module-to- multichip module levels will enable future avionics systems requirements to be met by eliminating undesirable compromises associated with electrical interconnects. Fiber optics is the well established medium of choice for cabinet-to-cabinet applications, while planar polymeric interconnects are required at the backplane level. Significant advances have been made in demonstrating practical polymer interconnects compatible with existing board fabrication principles, however both waveguide loss and interfaces to optoelectronic components require further improvement before the technology is broadly applicable.

Paper Details

Date Published: 1 July 1993
PDF: 7 pages
Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); doi: 10.1117/12.147108
Show Author Affiliations
Julian P. G. Bristow, Honeywell Systems and Research Ctr. (United States)
Charles T. Sullivan, Honeywell Systems and Research Ctr. (United States)
Sayan D. Mukherjee, Honeywell Systems and Research Ctr. (United States)
Yue Liu, Honeywell Systems and Research Ctr. (United States)
Anis Husain, Honeywell Systems and Research Ctr. (United States)

Published in SPIE Proceedings Vol. 1849:
Optoelectronic Interconnects
Ray T. Chen, Editor(s)

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