Proceedings Paper
Multi-fiber/chip coupling and optoelectronic integrated circuit packaging based on flip-chip bonding techniques| Format | Member Price | Non-Member Price |
|---|---|---|
| $17.00 | $21.00 |
Paper Abstract
For the packaging of integrated InP devices we present two approaches, which rely on a passive fiber alignment. In one case the fibers are hold in V-grooves etched directly into the InP, alternatively, V-grooves are etched into Si and the InP chip is assembled by a self- aligning flip chip process.
Paper Details
Date Published: 1 July 1993
PDF: 4 pages
Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993);
Published in SPIE Proceedings Vol. 1849:
Optoelectronic Interconnects
Ray T. Chen, Editor(s)
PDF: 4 pages
Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993);
Show Author Affiliations
Rolf Weber, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)
F. Fidorra, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)
Michael Hamacher, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)
F. Fidorra, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)
Michael Hamacher, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)
Helmut Heidrich, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)
G. Jacumeit, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)
G. Jacumeit, Heinrich-Hertz-Institut fuer Nachrichtentechnik Berlin GmbH (Germany)
Published in SPIE Proceedings Vol. 1849:
Optoelectronic Interconnects
Ray T. Chen, Editor(s)
© SPIE. Terms of Use
