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Proceedings Paper

Packaged reconfigurable space-variant optical interconnect using wavelength multiplexed volume holograms
Author(s): Jian Ma; Brian E. Catanzaro; Walter Daeschner; Yeshaiahu Fainman; Sing H. Lee
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Paper Abstract

The packaging opto-electronic interconnects has the potential to create compact, highly dense communication networks. We present a packaged space-variant optical interconnect module using wavelength multiplexed volume holographic elements recorded in photorefractive materials. The input/output arrays (4 X 4), an illumination lenslet array, and a set of two wavelength multiplexed off-axis volume holographic lenslet arrays were integrated with a series of several glass substrates to form a free-space optical interconnect. The size of the packaged optical interconnect module was 40 mm X 24 mm X 37 mm. Reconfigurable interconnection was demonstrated on the packaged module by performing the perfect shuffle and butterfly networks, at different wavelengths. Several packaging issues, such as alignment, bonding, energy efficiency, and system scalability were studied.

Paper Details

Date Published: 1 July 1993
PDF: 13 pages
Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); doi: 10.1117/12.147085
Show Author Affiliations
Jian Ma, Univ. of California/San Diego (United States)
Brian E. Catanzaro, Univ. of California/San Diego (United States)
Walter Daeschner, Univ. of California/San Diego (United States)
Yeshaiahu Fainman, Univ. of California/San Diego (United States)
Sing H. Lee, Univ. of California/San Diego (United States)

Published in SPIE Proceedings Vol. 1849:
Optoelectronic Interconnects
Ray T. Chen, Editor(s)

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