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Proceedings Paper

Optical waveguide interconnections for optoelectronic multichip modules
Author(s): Hideyuki Takahara; Shinji Koike; Satoru Yamaguchi; Hisashi Tomimuro
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Paper Abstract

New packaging techniques for opto-electronic multichip modules (OE-MCMs), including OE substrates and optical coupling between a waveguide and a flip-chip bonded photodevice or fiber, are presented for high-speed and wide-band communication systems. The OE substrates, which offer high-density, high-speed optical and electrical interconnection, are made from low loss (0.4 dB/cm) optical polyimide waveguides fabricated on copper-polyimide electrical multilayer substrates. A total internal reflection mirror fabricated at the edge of the optical waveguide reflects the light propagating from the waveguide to a flip-chip bonded photodiode with a loss of less than 1.5 dB. The waveguides are coupled to fibers for inter-module interconnection using the self-aligning fiber guiding method.

Paper Details

Date Published: 1 July 1993
PDF: 14 pages
Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); doi: 10.1117/12.147081
Show Author Affiliations
Hideyuki Takahara, NTT Interdisciplinary Research Labs. (Japan)
Shinji Koike, NTT Interdisciplinary Research Labs. (Japan)
Satoru Yamaguchi, NTT Interdisciplinary Research Labs. (Japan)
Hisashi Tomimuro, NTT Interdisciplinary Research Labs. (Japan)

Published in SPIE Proceedings Vol. 1849:
Optoelectronic Interconnects
Ray T. Chen, Editor(s)

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