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Proceedings Paper

Compression-molded polymer-based optical bus
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Paper Abstract

In this paper, we report an optical bus fabrication technology using compression-molding technique. The linear dimension of such a waveguide is well beyond that of a microlithographically defined waveguide. The interconnection patterns such as fan-ins and fan- outs can be easily defined by the mold plunger. The resolution of compression molding can be as high as 2 micrometers . Therefore, optical bus density as high as approximately 104 channels/cm is producible while the linear dimension of the waveguide can be much larger than that made through conventional microlithography. Employment of optically transparent electronic packaging polymers (OTEPPs) as the system buses automatically provides process compatibility with silicon IC fabrication. All the polymer microstructure waveguide materials are either thermosets or thermoplastics. Both can be molded to a specific shape as desired.

Paper Details

Date Published: 1 July 1993
PDF: 9 pages
Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); doi: 10.1117/12.147080
Show Author Affiliations
Ray T. Chen, Univ. of Texas/Austin (United States)
Suning Tang, Univ. of Texas/Austin (United States)
Gajendra D. Savant, Physical Optics Corp. (United States)
Tomasz P. Jannson, Physical Optics Corp. (United States)

Published in SPIE Proceedings Vol. 1849:
Optoelectronic Interconnects
Ray T. Chen, Editor(s)

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