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Proceedings Paper

Profiling of multichip module interconnects with a hybrid high-speed triangulation range sensor
Author(s): Shahzad F. Kirmani; Paul R. Haugen; David M. Kranz
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Paper Abstract

To increase the functionality and complexity of microelectronic components, new packaging techniques such as multichip-modules (MCMs) are used. However, certain MCM manufacturing processes are limited by the yield and reliability of the electrical contacts formed by the solder interconnects or bumps. In this paper we describe an optical measurement system to detect defective electrical contacts before bonding occurs. By using a high-speed, laser-based point range sensor and a high speed part transport system, critical solder bump features such as volume, height and planarity can be measured.

Paper Details

Date Published: 28 May 1993
PDF: 8 pages
Proc. SPIE 1821, Industrial Applications of Optical Inspection, Metrology, and Sensing, (28 May 1993); doi: 10.1117/12.145553
Show Author Affiliations
Shahzad F. Kirmani, Cyber Optics Corp. (United States)
Paul R. Haugen, CyberOptics Corp. (United States)
David M. Kranz, CyberOptics Corp. (United States)

Published in SPIE Proceedings Vol. 1821:
Industrial Applications of Optical Inspection, Metrology, and Sensing
Gordon M. Brown; Kevin G. Harding; H. Philip Stahl, Editor(s)

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