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Proceedings Paper

Role of surface diffusion in electromigration phenomena
Author(s): Richard W. Vook; C. Y. Chang; C. W. Park
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Paper Abstract

Electromigration (EM) phenomena are generally and quite accurately attributed to electron flow enhanced grain boundary diffusion processes. However, there is clear evidence in the literature and in the work that will be presented, that surface or interface diffusion phenomena also contribute to electromigration damage (EMD) in Al, Cu, and alloy films. Most of this evidence comes from transmission and scanning electron microscope experiments carried out on samples that have experienced the latter stages of EMD stressing. Evidence for surface or interface diffusion occurs in hillock formation and annealing, film thinning, voiding and island formation, and regrowth-healing events on current reversal. The implications of these results in attempting to reduce EMD in microelectronic metallizations are presented.

Paper Details

Date Published: 21 May 1993
PDF: 12 pages
Proc. SPIE 1805, Submicrometer Metallization: Challenges, Opportunities, and Limitations, (21 May 1993); doi: 10.1117/12.145484
Show Author Affiliations
Richard W. Vook, Syracuse Univ. (United States)
C. Y. Chang, Syracuse Univ. (United States)
C. W. Park, Syracuse Univ. (United States)

Published in SPIE Proceedings Vol. 1805:
Submicrometer Metallization: Challenges, Opportunities, and Limitations
Thomas Kwok; Takamaro Kikkawa; Krishna Shenai, Editor(s)

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