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Proceedings Paper

Automatic defect classification system for semiconductor wafers
Author(s): Rivi Sherman; Ehud Tirosh; Zeev Smilansky
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Paper Abstract

The problem of automated defect classification has been recognized as one of the biggest challenges to successful integration of automated inspection into wafer manufacturing process. The high degree of customization required for each application adds another dimension to the inherent difficulties. For example, the input to an automatic classifier of printed circuit boards defects will be completely different from the input to a semiconductor defect classifier. Also, the heuristics used for classification will differ greatly. Furthermore, even in similar applications, different manufacturers will have different notions of how defects ought to be classified. In this paper we describe a system which attempts to automate the defect classification process, offering a high degree of adaptivity, customization and automation, with special emphasis on minimizing the need for input from a skilled user. Using Orbot's wafer inspection system, we concentrated on classification of defects on patterned wafers.

Paper Details

Date Published: 6 May 1993
PDF: 8 pages
Proc. SPIE 1907, Machine Vision Applications in Industrial Inspection, (6 May 1993); doi: 10.1117/12.144824
Show Author Affiliations
Rivi Sherman, Orbot Instruments Ltd. (Israel)
Ehud Tirosh, Orbot Instruments Ltd. (Israel)
Zeev Smilansky, Orbot Instruments Ltd. (Israel)

Published in SPIE Proceedings Vol. 1907:
Machine Vision Applications in Industrial Inspection
Frederick Y. Wu; Benjamin M. Dawson, Editor(s)

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