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Proceedings Paper

Microchannel heatsink with liquid-nitrogen cooling
Author(s): Robert A. Riddle; Anthony F. Bernhardt
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Paper Abstract

Excellent thermal performance of a silicon microchannel heatsink is demonstrated using liquid nitrogen as the coolant over a wide range of heat loads up to 1 kW/cm2. This performance is partly due to the order of magnitude increase in the thermal conductivity of silicon near 77 degree(s)K compared to room temperature. Subcooled boiling of the liquid nitrogen in the microchannel heatsink further enhances the thermal performance but makes the thermal resistance a nonlinear function of heat load. For a 500 W/cm2 heat load, a thermal resistance of 0.052 cm2*0C/W for a 9:1 aspect ratio heatsink was measured.

Paper Details

Date Published: 25 February 1993
PDF: 9 pages
Proc. SPIE 1739, High Heat Flux Engineering, (25 February 1993); doi: 10.1117/12.140527
Show Author Affiliations
Robert A. Riddle, Lawrence Livermore National Lab. (United States)
Anthony F. Bernhardt, Lawrence Livermore National Lab. (United States)

Published in SPIE Proceedings Vol. 1739:
High Heat Flux Engineering
Ali M. Khounsary, Editor(s)

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