The advent of LSI/VLSI systems has made possible the development of advanced electronic systems operating in the multi-GHz regime. such high speed systems will be of multichip construction to increase miniaturization, packing, and heat dissipation density. Similar advances in high laser-power optics have resulted in significant increases in heat flux density. The stringent temperature uniformity specifications on these systems demand innovative means of applying state-of-the-art technology in enhancing heat removal. Promising cooling techniques that will meet the future thermal control requirements for these electronic and optics packages are presented. These concepts involve the use of microchannel, droplet impingement, jet impingement, and flow boiling in straight or curved channels.

Date Published: 25 February 1993
PDF: 12 pages
Proc. SPIE 1739, High Heat Flux Engineering, (25 February 1993); doi: 10.1117/12.140499

Published in SPIE Proceedings Vol. 1739:
High Heat Flux Engineering
Ali M. Khounsary, Editor(s)