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Proceedings Paper

High-resolution infrared signature modeling: a U.S. Army perspective
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Paper Abstract

For years, thermal model developers have promoted the approach of using simulated data validated by measurements as the best method of analyzing all aspects of a thermal signature -- target, background, atmosphere, and imager. Recent advances in high speed CPUs and high performance graphic workstations have allowed for improved proficiency in these thermal signature models and has helped convince `the user' that the modeled approach is viable. Now, targets and backgrounds can be modeled more quickly and with better realism and imagers of all types can be simulated in practical runtimes. These improved capabilities increase the temptation to look to modeling as the panacea for all difficulties encountered in infrared imaging as sensor designers, smart weapons designers, and vehicle concept designers all realize the cost and practical limitations of using measured data only. This paper examines the benefits and pitfalls experienced by U.S. Army modelers particularly in the target and background modeling area and provides some guidelines for future modeling directions.

Paper Details

Date Published: 1 September 1992
PDF: 11 pages
Proc. SPIE 1685, Infrared Detectors and Focal Plane Arrays II, (1 September 1992); doi: 10.1117/12.137820
Show Author Affiliations
Teresa G. Gonda, U.S. Army Tank-Automotive Command (United States)
Grant R. Gerhart, U.S. Army Tank-Automotive Command (United States)

Published in SPIE Proceedings Vol. 1685:
Infrared Detectors and Focal Plane Arrays II
Eustace L. Dereniak; Robert E. Sampson, Editor(s)

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