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Proceedings Paper

Investigation of the stress distribution in intact bonds by holographic interferometry and finite element method
Author(s): Thomas Bischof; Werner P. O. Jueptner
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Paper Abstract

Adhesive bonding, especially the overlap adhesive bonded joint, is used in many applications, as in aircraft construction. For the development of new kinds of adhesives, there must be a testing technique which allows a fast and reliable detection of the stress distribution in the adhesive layer. In BIAS a method was developed which allows measurement of the entire specimen deformation. This deformation can be split into two parts: the adhesive layer and the two plate deformation. It has been shown by FEM calculation that in regions where the adhesive layer strain has its maximum, the entire specimen deformation is almost exclusively composed of the adhesive layer deformation. With this knowledge it is possible to determine the adhesive layer stress distribution by measuring the total deformation of the specimen.

Paper Details

Date Published: 1 January 1992
PDF: 6 pages
Proc. SPIE 1553, Laser Interferometry IV: Computer-Aided Interferometry, (1 January 1992); doi: 10.1117/12.135318
Show Author Affiliations
Thomas Bischof, BIAS (Germany)
Werner P. O. Jueptner, BIAS (Germany)

Published in SPIE Proceedings Vol. 1553:
Laser Interferometry IV: Computer-Aided Interferometry
Ryszard J. Pryputniewicz, Editor(s)

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