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Proceedings Paper

New method of thermal placement in hybrid circuits
Author(s): Andrzej Kos
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Paper Abstract

The paper deals with the quasi-optimum placement and temperature estimation of heat dissipating components in hybrid power circuits. A placement is found when the extreme temperatures on the substrate are minimized. Whereas classical techniques require large computational effort, a method presented in this paper is simple and rapid. It couples two main ideas: a heuristic approach to the placement problem and a neural computation of temperature.

Paper Details

Date Published: 1 August 1992
PDF: 12 pages
Proc. SPIE 1783, International Conference of Microelectronics: Microelectronics '92, (1 August 1992); doi: 10.1117/12.131043
Show Author Affiliations
Andrzej Kos, Academy of Mining and Metallurgy (Poland)

Published in SPIE Proceedings Vol. 1783:
International Conference of Microelectronics: Microelectronics '92
Andrzej Sowinski; Jan Grzybowski; Witold T. Kucharski; Ryszard S. Romaniuk, Editor(s)

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