Share Email Print

Proceedings Paper

Process solutions for the global proximity effect on submicron lithography
Author(s): Daniel Hao-Tien Lee; Ronfu Chu
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Proximity effect, in general, is a major concern for submicron lithography. There are two kinds of proximity effect, i.e. global and local proximity effects, normally observed in the submicron lithography processes. Local proximity effect is occurred as a result of interaction between adjacent patterns, in which elbow rounding and proximity effect between adjacent contact holes are two typical examples. Global proximity effect is as a result of thin film interference of photoresist thickness variation over topography. The critical dimension variation between cell array and periphery patterns is a typical case. In this paper we will discuss several process approaches to the solution of global proximity effect. An optimum process to minimize the global proximity effect will be described.

Paper Details

Date Published: 1 June 1992
PDF: 15 pages
Proc. SPIE 1674, Optical/Laser Microlithography V, (1 June 1992); doi: 10.1117/12.130318
Show Author Affiliations
Daniel Hao-Tien Lee, Industrial Technology Research Institute (Taiwan)
Ronfu Chu, ASM Lithography, Inc. (Taiwan)

Published in SPIE Proceedings Vol. 1674:
Optical/Laser Microlithography V
John D. Cuthbert, Editor(s)

© SPIE. Terms of Use
Back to Top