SPIE and the programme committee invite you to participate in Silicon Photonics, emerging applications. In the past several years there has been a rapidly rising demand for Silicon Photonics systems due to the significant advantages the photonic integrated circuits (PICs) platform can offer. They are small, highly efficient, low-power, and offer high-speed performance, all at a low cost. Silicon PICs are revolutionising short reach interconnects for datacentre applications with the market now worth >$1 billion USD. However, new applications areas are emerging beyond traditional telecoms and datacoms such as sensing, computing and LiDAR. These applications are impacting markets such as automotive, homeland security and healthcare.

In this programme recent progress in design, fabrication and characterisation of photonic-electronic integrated circuits, and the emerging applications and opportunities for adoption of Silicon Photonics technologies will be discussed.

Leaders in the industry, research experts and entrepreneurs will be presenting their latest work.

Original papers are especially requested in the following areas:

Applications Design Manufacturing and testing Devices Platforms ;
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Conference 11880

Emerging Applications in Silicon Photonics II

In person: 29 - 30 September 2021 | Boisdale 1
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  • Wednesday Plenary Session
  • 1: Silicon Photonics in Quantum Technologies: Joint Session with Conferences 11880 and 11881
  • 2: Emerging Applications in Silicon Photonics I
  • 3: Emerging Applications in Silicon Photonics II
  • Thursday Plenary Session
  • 4: Emerging Applications in Silicon Photonics III
  • 5: H2020 PICTURE Project
  • 6: Emerging Applications in Silicon Photonics IV
  • Closing Remarks and Best Contributed Paper Award Presentation
Wednesday Plenary Session
In person: 29 September 2021 • 9:00 AM - 10:00 AM BST | Lomond Auditorium
09:00: Welcome, Introduction, and Special Announcement
David Andrews, SPIE President, Univ. of East Anglia (United Kingdom)

09:20: Understanding the Role of Photonics in a Changing World

Carol Monaghan, Member of the Science and Technology Select Committee, Parliamentary Office of Science and Technology (board member), Industry and Parliament Trust (board member), Chair of the All-Party Parliamentary Group on Photonics and Quantum, Vice Chair All Party Parliamentary Group on Space (United Kingdom)

For decades, the photonics industry has been at the forefront of global innovation and research. Developments such as advanced LIDAR systems for autonomous vehicles, secure quantum computers and 5G communications, ensure that this sector remains as relevant as ever with the potential for major growth across multiple technologies. However increased threats to national security mean that the importance of this industry goes beyond basic economics. Set against a backdrop of a challenging funding landscape, can governments really afford not to invest in photonics and quantum?

Carol Monaghan graduated from the University of Strathclyde in 1993 with a BSc (Hons) in Laser Physics and Optoelectronics before training as a physics teacher. Her 20-year teaching career included 14 years as Head of Physics and Science at Hyndland Secondary. Carol was first elected as the MP for Glasgow North West in 2015 and re-elected in 2017 and 2019. She is the SNP’s Westminster Spokesperson for Education, Armed Forces and Veterans.

09:45: Question & Answer with Carol Monaghan

09:55: Welcome by Lord Provost of the City of Glasgow

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Author(s): Carol Monaghan, UK Parliament (United Kingdom)
In person: 29 September 2021 • 9:00 AM - 10:00 AM BST | Lomond Auditorium
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For decades, the photonics industry has been at the forefront of global innovation and research. Developments such as advanced LIDAR systems for autonomous vehicles, secure quantum computers and 5G communications, ensure that this sector remains as relevant as ever with the potential for major growth across multiple technologies. However increased threats to national security mean that the importance of this industry goes beyond basic economics. Set against a backdrop of a challenging funding landscape, can governments really afford not to invest in photonics and quantum?
Break
Coffee Break 10:00 AM - 10:30 AM
Session 1: Silicon Photonics in Quantum Technologies: Joint Session with Conferences 11880 and 11881
In person: 29 September 2021 • 10:30 AM - 12:30 PM BST | Lomond Auditorium
Session Chair: Callum G. Littlejohns, Univ. of Southampton (United Kingdom)
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Author(s): Stephen P. Najda, P. Perlin, T. Suski, TopGaN Ltd. (Poland); Szymon Stanczyk, Institute of High Pressure Physics (Poland); M. Leszczynski, D. Schiavon, TopGaN Ltd. (Poland); T. Slight, Sivers Photonics Ltd. (United Kingdom); S. Gwyn, S. Watson, A. E. Kelly, Univ. of Glasgow (United Kingdom); M. Knapp, M. Haji, National Physical Lab. (United Kingdom)
On demand | Presented Live 29 September 2021
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GaN laser diodes have the potential to be a key enabler for many quantum technologies since the AlGaInN material system allows for laser diodes to be fabricated over a wide range of wavelengths from ultra-violet to visible. Novel applications for quantum technologies include GaN laser sources for cold-atom interferometry, such as optical atomic clocks, quantum sensors and quantum computing. GaN allows the development of very high specification laser diode sources that are portable, robust and provide practical solutions that are otherwise unobtainable using more conventional laser sources. Several approaches are taken to achieve the required linewidth, wavelength and power for cold-atom interferometry, including an extended cavity GaN laser diode (ECLD) system, and a distributed feedback (DFB) GaN laser diode with side-wall etched nano-gratings. We report our latest results on GaN laser diodes for quantum technologies.
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Author(s): Krishna Coimbatore Balram, Univ. of Bristol (United Kingdom)
In person: 29 September 2021 • 10:50 AM - 11:10 AM BST | Lomond Auditorium
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Adapting existing foundry platforms for applications in quantum photonics presents an exciting research challenge, as these platforms were not originally designed with 'quantum' applications in mind, in particular, the choice of materials, the need for high efficiency and extreme operating temperatures. In this talk, I will discuss our efforts towards this goal on three different front: incorporating atom-like systems in a SiN PIC platform, development of MEMS based phase shifters in a standard silicon photonics process with a view towards cryogenic operation of large scale PICs, and finally our work towards building quantum microwave to optical signal transducers using MEMS foundry designed high overtone bulk acoustic wave resonators.
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Author(s): Ross W. Millar, Jaroslaw Kirdoda, Univ. of Glasgow (United Kingdom); Fiona E. Thorburn, Xin Yi, Zoë Greener, Laura L. Huddleston, Heriot-Watt Univ. (United Kingdom); Bhavana Benakaprasad, Scott Watson, Conor Coughlan, Univ. of Glasgow (United Kingdom); Gerald S. Buller, Heriot-Watt Univ. (United Kingdom); Douglas J. Paul, Univ. of Glasgow (United Kingdom)
On demand | Presented Live 29 September 2021
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Single Photon Avalanche Diode (SPAD) detectors are key for numerous quantum and 3D imaging applications and operation in the short-wave infrared (SWIR) is either essential or beneficial for such applications. Here, we present a 26µm diameter, pseudo-planar Ge-on-Si SPAD, which exhibits record low noise-equivalent-power (NEP) of 7.7×10−17WHz−1/2 at 1310nm wavelength (125K). The devices have dark-count-rates as low as kilocounts/s at 100K and single photon detection efficiencies up to ~29%. These results represent a 2 orders-of-magnitude improvement in NEP compared to previous 25 µm Ge-on-Si mesa SPADs and demonstrate the potential for efficient Si compatible SPADs operating in the SWIR.
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Author(s): Ségolène Olivier, CEA-LETI (France)
In person: 29 September 2021 • 11:30 AM - 11:50 AM BST | Lomond Auditorium
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Silicon photonics based on CMOS technology is a very attractive platform to build compact, low-cost and scalable quantum photonics integrated circuits addressing the requirements of advanced quantum key distribution protocols and photonic quantum processing schemes. We show record low propagation losses below 0.5 dB/cm and below 0.05 dB/cm for silicon and silicon nitride waveguides respectively. We will present our latest results on integrated components such as high-quality microresonators for heralded single photon generation and we will show our recent developments on high crystalline quality NbN thin films with improved critical temperature for waveguide-integrated superconducting single photon detectors.
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Author(s): James Brown, Hamamatsu Photonics UK Ltd. (United Kingdom)
In person: 29 September 2021 • 11:50 AM - 12:10 PM BST | Lomond Auditorium
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Hamamatsu introduces their new scientific camera – the ORCA-Quest®, with incredibly low noise of 0.27 electrons rms and a high pixel count of 9.4 megapixels. In quantitative imaging, the photoelectric noise generated when light is converted into electrical signals is the all-important factor that determines the lower detection limit of a camera. The ORCA-Quest is able to reduce this photoelectric noise to a level below the signals generated by photons, making it the world’s first camera to achieve 2D photon-number-resolving measurement, meaning that it accurately measures the number of photons within each pixel.
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Author(s): Richard C. A. Pitwon, Resolute Photonics Ltd. (United Kingdom); Bernard H. L. Lee, SENKO Advanced Components (Euro) Ltd. (United Kingdom)
On demand | Presented Live 29 September 2021
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Quantum technologies are progressing to market faster than anticipated with commercial and consumer applications starting to emerge. The rapid development of quantum capability is also being fueled by a geopolitical competition centred on quantum communication and computation. Standardisation will accelerate commercial adoption of emerging technologies by establishing commonly agreed frameworks, terminologies, design guidelines and performance benchmarks by which to apply the technology. In this paper we report on the nascent activities in mainstream international standards bodies to standardize different aspects of quantum technologies and identify where standards will be most relevant and will not impede future innovation.
Break
Lunch/Exhibition Break 12:30 PM - 2:00 PM
Session 2: Emerging Applications in Silicon Photonics I
In person: 29 September 2021 • 2:00 PM - 3:30 PM BST | Boisdale 1
Session Chair: Katarzyna Balakier, Airbus Defence and Space (United Kingdom), Univ. College London (United Kingdom)
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Author(s): Remus Nicolaescu, Pointcloud Inc. (United States)
In person: 29 September 2021 • 2:00 PM - 2:30 PM BST | Boisdale 1
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Accurate 3D imaging is essential for machines to map and interact with the physical world. While numerous 3D imaging technologies exist, each addressing niche applications with varying degrees of success, none have achieved the breadth of applicability and impact that digital image sensors have achieved in the 2D imaging world. A large-scale, two-dimensional focal plane array of coherent detector pixels operating as a light detection and ranging (LiDAR) system could serve as the core of a universal 3D imaging platform. It would enable megapixel resolution, high depth accuracy, immunity to interference from sunlight, as well as the ability to directly measure the velocity of moving objects. This talk will present an overview of architectural implementations of large-scale coherent focal plane arrays, and show results of their operation in a 4D imaging (3D + velocity) system. We will discuss performance characteristics, tradeoffs, design optimization and future implementations.
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Author(s): Tyler V. Howard, Thomas G. Brown, Univ. of Rochester (United States)
On demand | Presented Live 29 September 2021
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Photonic integrated circuits (PICs) are a growing versatile, advantageous technology, but testing of PICs for losses, efficient coupling/splitting, and polarization states are still lacking and needed for high quality foundry-produced PICs. Current methods can’t accomplish all these functions but take up value chip real estate. Our solution introduces deterministic, subwavelength scattering elements imaged using short-wave infrared microscope camera-based testing. Finite-difference time-domains with subsequent numerical propagations methods show a high degree of polarization sensitivity to input light. Using PICs fabricated in the AIM Photonics foundry, we observed scattered light >20x brighter than the background with good polarization discrimination.
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Author(s): Bharat Pant, Weiwei Zhang, Denh Tran, Mehdi Banakar, Han Du, Xingzhao Yan, Callum G. Littlejohns, Graham T. Reed, David J. Thomson, Optoelectronics Research Ctr. (United Kingdom)
In person: 29 September 2021 • 2:50 PM - 3:10 PM BST | Boisdale 1
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We propose and demonstrate a device design for power reduction in optical phase shifter based on Mach-Zehnder interferometer (MZI). The multimode region of a 2x2 Multi-Mode-Interferometer (MMI) is used as the modulation region. The light is circulated through the same multimode region twice and therefore utilizes the already present change in temperature/carriers leading to additional phase change, and an increase in efficiency compared to conventional Single-mode waveguide based phase shifting components. The devices show low insertion loss penalty and do not add any fabrication complexity.
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Author(s): Jose M. Pozo, EPIC-European Photonics Industry Consortium (France)
In person: 29 September 2021 • 3:10 PM - 3:30 PM BST | Boisdale 1
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Photonic Integrated Circuits (PIC) technologies are attracting increased attention due to their high industrial take-up in several applications beyond the traditional datacom and telecom, such as medical, environmental, automotive, structural monitoring, agriculture and the next quantum-enabled world. This has resulted in a vast amount of opportunities for the photonic industry, from wafer level manufacturing and testing, to volume assembly and packaging. During this presentation, we will review some of the latest trends and resulting supply chain developments in the European ecosystem.
Break
Coffee Break 3:30 PM - 4:00 PM
Session 3: Emerging Applications in Silicon Photonics II
In person: 29 September 2021 • 4:00 PM - 5:20 PM BST | Boisdale 1
Session Chair: Richard C. A. Pitwon, Resolute Photonics Ltd. (United Kingdom)
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Author(s): Wim Bogaerts, Lukas Van Iseghem, Mi Wang, Hong Deng, Xiangfeng Chen, Iman Zand, K.P. Nagarjun, Muhammad Umar Khan, Univ. Gent (Belgium), imec (Belgium)
On demand | Presented Live 29 September 2021
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Programmable photonic circuits, in contrast to classical photonic integrated circuits (PIC), can be configured at run-time to route light along different paths and perform different optical functions. This is accomplished by a mesh of interconnected waveguides that are coupled using electrically actuated tunable couplers and phase shifters. Such a waveguide mesh can redefine the connectivity between functional building blocks, but can also be configured into interferometric and resonant wavelength filters. The generic nature of such programmable PICs will lower the threshold to develop new applications based on photonic chips, in a similar way as programmable electronics.
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Author(s): Ying Lia Li, Zero Point Motion (United Kingdom)
On demand | Presented Live 29 September 2021
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As silicon photonics matures, optical analogues of existing technologies can be realised that benefit from the low noise and highly stable output of coherent light. Zero Point Motion reports on progress in developing optomechanical inertial sensors that use optical whispering gallery mode resonances to measure the mechanical motion of test-mass structures susceptible to inertial forces.
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Author(s): Iain F. Crowe, The Univ. of Manchester (United Kingdom)
In person: 29 September 2021 • 4:40 PM - 5:00 PM BST | Boisdale 1
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The optical response of a graphene oxide integrated silicon microring resonator (GOMRR) to a range of vapour phase Volatile Organic Compounds (VOCs) is reported. The response of the GOMRR to all but one (hexane) of the VOCs is significantly higher than that of an un-coated (control) MRR, for the same delivered vapour concentration. Analytical modelling of the experimental data, based on the 'Hill-Langmuir' adsorption isotherm, suggests these changes are determined by the degree of molecular 'cooperativity', which is enhanced for polar solvents. This molecular dependent capillary condensation within the GO layer structure may therefore provide a route to sensitive and label-free selective detection of harmful vapour/gas phase VOCs.
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CANCELED: Silicon photonics open access foundry services review for emerging technology
In person: 29 September 2021 • 5:00 PM - 5:20 PM BST | Boisdale 1
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Silicon Photonics has moved from being a prominent research topic to not only quickly becoming the backbone of datacentres around the world, but it is also considered the driving game-changer in emerging technologies such as biomedical and quantum applications. This paper presents a review of available foundry services offering Silicon Photonics, comparing the key technologies available. The foundries providing these unique technologies include AMF, CEA Leti, CORNERSTONE, ihp, imec, and LioniX International. The review will also show examples of Silicon Photonics in emerging application domains from selected foundries, covering examples such as spectrometers and ultrasound detection for biomedical applications.
Thursday Plenary Session
In person: 30 September 2021 • 9:00 AM - 10:00 AM BST | Lomond Auditorium
09:00: Welcome and Introduction
David Andrews, SPIE President, Univ. of East Anglia (United Kingdom)

09:20: Strengthening Our Superpowers: Technology, Missions, and the UK Innovation Strategy


Simone Boekelaar, Innovate UK (United Kingdom)

What does HMG’s new Innovation Strategy tell us about how this government will intervene to promote emerging tech, and what it wants to achieve by doing so? What might this look like from the photonics’ sector’s perspective? A chance to hear about the evolution and objectives of the governments’ new innovation strategy, along with potential plans for implementation and industry engagement.

Simone Boekelaar is the Head of Horizon Scanning at Innovate UK, the UK government’s innovation agency. With a background in economics and engineering, Simone leads a team that scans for the emerging technologies and trends that will be most impactful on UK industry in 2030 and beyond. From health diagnostics to entertainment, from space travel to manufacturing glass bottles, Simone and her team scour the academic and industrial worlds to seek out the under-supported and overlooked technologies and trends likely to be critical to all our futures.

09:45: Question & Answer with Simone Boekelaar
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Author(s): Simone Boekelaar, Innovate UK (United Kingdom)
In person: 30 September 2021 • 9:00 AM - 10:00 AM BST | Lomond Auditorium
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What does HMG’s new Innovation Strategy tell us about how this government will intervene to promote emerging tech, and what it wants to achieve by doing so? What might this look like from the photonics’ sector’s perspective? A chance to hear about the evolution and objectives of the governments’ new innovation strategy, along with potential plans for implementation and industry engagement.
Break
Coffee Break 10:00 AM - 10:30 AM
Session 4: Emerging Applications in Silicon Photonics III
In person: 30 September 2021 • 10:30 AM - 12:20 PM BST | Boisdale 1
Session Chair: Marc Sorel, Univ. of Glasgow (United Kingdom)
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Author(s): Ke Li, David J. Thomson, Weiwei Zhang, Shenghao Liu, XingZhao Yan, Callum G. Littlejohns, Mehdi Banakar, Han Du, Wei Cao, Fanfan Meng, Martin Ebert, Ying Tran, Periklis Petropoulos, Graham T. Reed, Univ. of Southampton (United Kingdom)
On demand | Presented Live 30 September 2021
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The interest in developing high-performance optical modulator to meet the growing demands of data processing speed has increased over the last decade. While there have been significant research efforts in developing standalone silicon modulators, works on integrating those with electronics is limited, which is necessary for the practical implementation of short-reach optical interconnects. In contrast to previous work in the field where electronic–photonic integration was mostly limited to the physical coupling approach, we have introduced a new design philosophy, where photonics and electronics must be considered as a single integrated system in order to tackle the demanding technical challenges of this field. In this work, I shall present our recent 100Gb/s silicon photonics transmitter, where photonic and electronic devices are co-designed synergistically in terms of device packaging, power efficiency, operation speed, footprint and modulation format.
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Author(s): Thomas F. Krauss, Univ. of York (United Kingdom)
In person: 30 September 2021 • 11:00 AM - 11:20 AM BST | Boisdale 1
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The healthcare market offers the next big opportunity for the large scale roll-out of sensor technologies based on silicon photonics, especially since healthcare applications typically require single-use, disposable tests that need to offer high precision at low cost. Here, I will describe two examples of silicon photonics sensor technology able to address this need, namely a) a protein immunosensor exploiting resonant photonic nanostructures that can achieve the same performance as a laboratory instrument such as ELISA yet in a handheld, portable format and b) a concept for an absorption spectroscopy sensor operating in the mid-infrared, aiming to achieve “FTIR on-chip” functionality.
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Author(s): Farah Comis, EPSRC Ctr. for Doctoral Training in Connected Electronic and Photonic Systems (United Kingdom), Univ. College London (United Kingdom), Univ. of Cambridge (United Kingdom); Alfonso Ruocco, Univ. College London (United Kingdom)
On demand | Presented Live 30 September 2021
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We propose a solution to implement a simulation routine suitable for the design of fabrication-tolerant Kerr-comb generators by looking at the waveguides’ geometry affected by the tolerance. The multiparameter-space analysis highlighted that while several waveguide cross-sections are suitable for the comb generation, they don’t all provide the same safety buffer toward the fabrication variability. Thus, some designs are preferred to other suitable ones. This approach paves the way to high yield, scalable and fabrication-tolerant integrated Kerr comb generators (KCGs) manufactured in complementary metal-oxide-semiconductor (CMOS) foundries.
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Author(s): Iain Eddie, Andrew McKee, Laura Meriggi, Antonio Samarelli, Stuart Smyth, Horacio Cantu, Sivers Photonics Ltd. (United Kingdom)
On demand | Presented Live 30 September 2021
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Integration of InP laser sources is a key enabling technology for Silicon Photonics and requires customised InP chips that meet the mechanical and optical requirements of a diverse range of Si Photonics architectures. The Sivers Photonics InP100 Platform is a common design and manufacturing framework for InP photonics devices that uses established process modules to produce a broad range of device types on 100mm wafers. This approach reduces cycle times for the development of customised device designs, has proven reliability, and is scalable to high volume manufacturing. The InP100 platform enables integration of customised InP chips with Si Photonics chips (e.g. via flip chip bonding), for applications for applications such as LIDAR, sensing and communications.
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Author(s): Xuezhe Yu, Keshuang Li, Junjie Yang, Ying Lu, Zizhuo Liu, Mingchu Tang, Pamela Jurczak, Jae-Seong Park, Huiwen Deng, Hui Jia, Manyu Dang, Univ. College London (United Kingdom); Ana M. Sanchez, Richard Beanland, The Univ. of Warwick (United Kingdom); Wei Li, Xiaodong Han, Beijing Univ. of Technology (China); Jinchuan Zhang, Huan Wang, Fengqi Liu, Institute of Semiconductors, Chinese Academy of Sciences (China); Siming Chen, Alwyn J. Seeds, Univ. College London (United Kingdom); Peter M. Smowton, Cardiff Univ. (United Kingdom); Huiyun Liu, Univ. College London (United Kingdom)
On demand | Presented Live 30 September 2021
Break
Lunch Break 12:20 PM - 1:35 PM
Session 5: H2020 PICTURE Project
In person: 30 September 2021 • 1:35 PM - 3:15 PM BST | Boisdale 1
Session Chair: Graham T. Reed, Optoelectronics Research Ctr. (United Kingdom)
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Author(s): Claire Besancon, Delphine Néel, Giancarlo Cerulo, Dalila Make, Nicolas I. Vaissiere, Frédéric Pommereau, III-V Lab., Nokia Bell Labs. (France), Thales Research & Technology (France), CEA-LETI (France); Frank Fournel, Loic Sanchez, Cécilia Dupré, Viviane Muffato, Univ. Grenoble Alpes (France), CEA-LETI (France); Jean Decobert, III-V Lab., Nokia Bell Labs. (France), Thales Research & Technology (France), CEA-LETI (France)
On demand | Presented Live 30 September 2021
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In this work, we present an advanced heterogeneous integration scheme which consists in integrating a thin InP layer by wafer-bonding onto a silicon wafer (InPoSi) on which a regrowth step of III-V materials is implemented. Vertical p-i-n AlGaInAs lasers obtained from a single Selective Area Growth (SAG) step on InPoSi were fabricated. Thanks to SAG, the AlGaInAs-MQW structures successfully cover a PL range of 160 nm in the C+L band. Based on these structures, a 5-channel laser array was fabricated. The latter successfully covers a 155 nm-wide spectral band from 1515 nm to 1670 nm with a maximum output power of 20 mW under continuous-wave regime at 20°C. High thermal stability up to 70°C is demonstrated with a characteristic temperature of 69°C for the lasers emitting from 1515 nm to 1600 nm.
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Author(s): David J. Thomson, Bigeng Chen, Weiwei Zhang, Martin Ebert, Xia Chen, Jamie Reynolds, Xingzhao Yan, Han Du, Mehdi Banakar, Ying Tran, Kapil Debnath, Callum G. Littlejohns, Shin Saito, Graham T. Reed, Optoelectronics Research Ctr. (United Kingdom)
On demand | Presented Live 30 September 2021
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The silicon optical modulator is a key component in a high speed optical data link. To advance the modulator performance beyond the popular carrier depletion based devices, we have produced a capacitive device which is instead based upon the accumulation of free carriers either side of a thin insulating layer positioned in the middle of the waveguide. Such a device has a superior efficiency compared with the carrier depletion approach allowing compactness and improved power consumption whilst retaining high speed operation and CMOS compatibility.
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Author(s): Valentin Ramez, Karim Hassan, Stephane Malhouitre, Loic SANCHEZ, Viviane Muffato, Yohan Desiere, CEA-LETI (France); Nicolas I. Vaissiere, Delphine Néel, Alexandre Shen, Arnaud Wilk, III-V Lab. (France)
In person: 30 September 2021 • 2:15 PM - 2:35 PM BST | Boisdale 1
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The objective of PICTURE project is to develop a photonic integration technology by bonding multiple III-V dies of different epitaxial stacks to SOI wafers with a thinner and more uniform dielectric bonding layer. This heterogeneous integration platform will enable higher performance devices using locally optimized III-V dies. In addition, the thin bonding layer will lead to state-of-the art performances MOSCAP modulators, and to a novel fast tunable capacitive DFB lasers. Two types of PICs with a total capacity of 400Gb/s are targeted after packaging and in system tests.
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Author(s): Laurens Breyne, Univ. Gent (Belgium); Joris Lambrecht, Michael Vanhoecke, imec (Belgium); Peter Ossieur, imec (Belgium), Univ. Gent (Belgium); Günther Roelkens, Univ. Gent (Belgium); Johan Bauwelinck, imec (Belgium), Univ. Gent (Belgium); Xin Yin, Univ. Gent (Belgium), imec (Belgium)
On demand | Presented Live 30 September 2021
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This paper discusses our progress on high-speed optical transmitters for next generation intra-datacenter interconnects. Silicon integrated photonic systems have a key role to play in this evolution by allowing compact, fast, innovative and cost-effective devices to be manufactured in large volumes. Especially silicon Mach-Zehnder modulators are a very attractive candidate: they are easy to manufacture, easy to use and support both intensity as well as coherent modulation. However, key to the next-generation optical transmitter is not only the very high datarates, but also the very small form-factor and low power consumption. This requires leveraging electro-optic co-design of driver electronics and optical modulators.
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Author(s): Delphine Néel, Alexandre Shen, Pierre Fanneau de La Horie, Nicolas I. Vaissière, Arnaud Wilk, III-V Lab. (France); Viviane Muffato, Stéphane Malhouitre, Valentin Ramez, Yohan Desières, Karim Hassan, CEA-LETI (France)
On demand | Presented Live 30 September 2021
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In the frame of the H2020 PICTURE project, we designed and developed densely integrated photonic devices and transceiver (TRx) circuits for high bit-rate telecom and datacom applications. We implemented a process with four different InP-based dies bonded on SOI wafers. With one sole back-end processing run, we achieved the fabrication of multiple components of the complex TRx circuits, and many building block devices, such as III-V/Si SOAs & Fabry-Perot lasers, photodiodes or fast tunable capacitive DFB lasers. First testing of these devices shows promising results. 13dBm-saturation power SOAs and less than 2ns-tuning time capacitive DFB lasers were fabricated and demonstrated.
Break
Coffee Break/Poster Session 3:15 PM - 3:45 PM
Session 6: Emerging Applications in Silicon Photonics IV
In person: 30 September 2021 • 3:45 PM - 5:05 PM BST | Boisdale 1
Session Chair: Ying Lia Li, Zero Point Motion (United Kingdom)
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Author(s): Amin Abbasi, Marcus S. Dahlem, imec (Belgium)
On demand | Presented Live 30 September 2021
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Integrated photonic is penetrating different segments of the commercial market beyond classical tele/datacom where it provides distinct features such as compactness, low cost, reliability and robustness. In this talk we will focus on these aspects and couple of applications will be introduced. Solid-state lidar has been an exciting research topic for quite a while. And now it’s finding its way into commercial products. Especially automotive applications, such as ADAS technologies, are craving compact, robust and inexpensive systems for 3D mapping.
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Author(s): Miloš A. Popovic, Boston Univ. (United States)
On demand | Presented Live 30 September 2021
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I review progress in monolithic electronic-photonic platforms, including devices and systems-on-chip (SoCs), for communication applications including in-package I/O, cryogenic data egress and quantum photonic networks. I present developments from Ayar Labs towards Terabit to Petabit scale I/O from a single processor package, including co-packaged photonic I/O chiplets with a commercial FPGA, and 1Tbps from a single chiplet; university research demonstrations of record device performances; a cryogenic photonic data link concept and 4K electronic-photonic transmitter demo that could address the I/O bottleneck of superconducting electronics for future supercomputing platforms; and our efforts on electronic-photonic quantum systems-on-chip (epQSoCs) for photonic quantum networks.
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Author(s): Mohamed F. Fouda, Emanuel Peinke, 3e8, Inc. (Canada)
On demand | Presented Live 30 September 2021
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In this work, we discuss the requirements and challenges of designing a photonic computing chip that can be deployed in the latest commercial AI systems. Silicon Photonics have the potential to revolutionize AI computing by delivering unprecedented improvements in the power consumption and computational throughput of AI computations. Still, there are several challenges to be tackled. Among these are the need to design high-density photonic integrated circuits, designing photonic memory systems for data storage, and solving the bottleneck of the electrical-to-optical conversions. Several innovative photonic technologies have been introduced to address these challenges. The progress on implementing these technologies is discussed.
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Author(s): Laura M. Lechuga Gómez, Institut Català de Nanociència i Nanotecnologia (ICN2) (Spain)
On demand | Presented Live 30 September 2021
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COVID-19 pandemics has evidenced the urgent need of having portable diagnostic tools that enable rapid testing and screening of the population with sensitivity and specificity levels comparable to laboratory techniques. Biosensor technology is one of the best prepared to tackle the challenging goal of offering fast and user-friendly diagnostics tests than can be employed at the point-of-need. We have shown how optical biosensors based on silicon photonics can provide sensitive, reliable and selective analysis, while reducing test and therapeutic turnaround times, decreasing and/or eliminating sample transport, and using low sample volume. And, more importantly, silicon photonics biosensor technology can provide quantification of the viral load, which is of paramount importance in the management of the disease.
Closing Remarks and Best Contributed Paper Award Presentation
In person: 30 September 2021 • 5:05 PM - 5:25 PM BST | Boisdale 1
Session Chair: David N. Payne, Univ. of Southampton (United Kingdom)
Join Sir David Payne, Optoelectronics Research Ctr. (United Kingdom), for the closing remarks on this second annual Emerging Applications in Silicon Photonics conference, and the announcement of the best contributed paper award, sponsored by Resolute Photonics.
Conference Chair
Callum G. Littlejohns
Univ. of Southampton (United Kingdom)
Conference Chair
Univ. of Glasgow (United Kingdom)
Program Committee
Airbus Defence and Space (United Kingdom)
Program Committee
CNIT - Photonic Networks & Technologies National Lab. (Italy)
Program Committee
Thalía Domínguez Bucio
Univ. of Southampton (United Kingdom)
Program Committee
Resolute Photonics Ltd. (United Kingdom)
Program Committee
Optoelectronics Research Ctr. (United Kingdom)