The Moscone Center
San Francisco, California, United States
2 - 7 February 2019
Conference 10924
Optical Interconnects XIX
Tuesday - Thursday 5 - 7 February 2019
Conference
Committee
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Conference Chairs
  • Henning Schröder, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
  • Ray T. Chen, The Univ. of Texas at Austin (United States)

Program Committee
Program Committee continued...
Tuesday 5 February Show All Abstracts
Session 1:
Electrical-Optical PCB Technologies
Tuesday 5 February 2019
8:00 AM - 9:50 AM
Session Chair:
Henning Schröder, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Single-mode polymer waveguides and devices for high-speed on-board optical interconnect application (Invited Paper)
Paper 10924-1
Author(s): Lin Ma, Xiao Xu, Zuyuan He, Shanghai Jiao Tong Univ. (China)
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Design and fabrication of integrated optical couplers by ion exchange in display glasses for EOCB
Paper 10924-2
Author(s): Marcel Neitz, Julian Schwietering, Technische Univ. Berlin (Germany); Norbert Arndt-Staufenbiel, Henning Schröder, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany); Martin Schneider-Ramelow, Technische Univ. Berlin (Germany)
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Erbium-doped polymer waveguide amplifiers for PCB-integrated optical links
Paper 10924-3
Author(s): Marcin W. Ziarko, Nikos Bamiedakis, Univ. of Cambridge (United Kingdom); Eric Kumi-Barimah, Gin Jose, Univ. of Leeds (United Kingdom); Richard V. Penty, Ian H. White, Univ. of Cambridge (United Kingdom)
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Mode-mixing in multimode polymer waveguides for on-board optical interconnects
Paper 10924-4
Author(s): Nikos Bamiedakis, Fengyuan Shi, Daping Chu, Richard V. Penty, Ian H. White, Univ. of Cambridge (United Kingdom)
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Large-size directly inscribed polymer waveguide device for card-to-card optical interconnect application
Paper 10924-5
Author(s): Lin Ma, Shanghai Jiao Tong Univ. (China); Xinhong Shi, TTM Technologies, Inc. (China); Marika Immonen, TTM Technologies, Inc. (Finland); Zuyuan He, Xiaoyu Yang, Shanghai Jiao Tong Univ. (China)
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Session 2:
Optical Interconnect Devices and Modulators
Tuesday 5 February 2019
10:20 AM - 12:30 PM
Directly modulated membrane-buried heterostructure lasers on SiO2/Si substrate (Invited Paper)
Paper 10924-6
Author(s): Shinji Matsuo, NTT Device Technology Labs. (Japan)
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Ultra-low power consumption silicon photonic link design analysis in the AIM PDK
Paper 10924-7
Author(s): Anthony J. Rizzo, Liang Yuan Dai, Xiang Meng, Madeleine Glick, Columbia Univ. (United States); Jigesh Patel, Synopsys, Inc. (United States); Keren Bergman, Columbia Univ. (United States)
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A plasmonic optical antenna enhanced avalanche photodetector with a high gain-bandwidth product for compact lidar applications (Invited Paper)
Paper 10924-8
Author(s): Thitikorn Kemsri, Boyang Xiang, Ainaz GhafaryAghdam, Univ. of Massachusetts Lowell (United States); Guiru Gu, Stonehill College (United States); Xuejun Lu, Univ. of Massachusetts Lowell (United States)
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Overcoming the barrier: innovating optoelectronics using standard CMOS (Invited Paper)
Paper 10924-9
Author(s): Patrick Chiang, PhotonIC Technologies (China)
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On-chip wireless photonic links for communication technology
Paper 10924-10
Author(s): Darya Krylova, Khalid M. Arif, Massey Univ. (New Zealand)
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Lunch/Exhibition Break 12:30 PM - 2:00 PM
Session 3:
Hybrid Integrated Optical Link Modules
Tuesday 5 February 2019
2:00 PM - 3:50 PM
Hybrid interconnection of InP and TriPleX photonic integrated circuits for new module functionality (Invited Paper)
Paper 10924-11
Author(s): Paulus van Dijk, Arne Leinse, LioniX International BV (Netherlands)
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From practice to practice--high-precision assembly of optoelectronic components basics and influencing factors: a case study
Paper 10924-12
Author(s): Matthias Lorenz, AEMtec GmbH (Germany)
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Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects (Invited Paper)
Paper 10924-13
Author(s): Nivesh Mangal, Univ. Gent (Belgium), IMEC (Belgium)
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A new generation of high-speed electro-optical transceivers and flexible bandwidth wavelength selective switches for coherent DCI: The QAMeleon project approach (Invited Paper)
Paper 10924-14
Author(s): Ioannis Lazarou, Maria Spyropoulou, Ioannis Kanakis, National Technical Univ. of Athens (Greece); Karl-Otto Velthaus, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany); Efthymios Rouvalis, Finisar Corp. (Germany); Guy Torfs, Univ. Gent (Belgium); Edgard Goobar, Finisar Sweden AB (Sweden); Rui Santos, SMART Photonics (Netherlands); Netsanet Tessema, Technische Univ. Eindhoven (Netherlands); Tobias Lamprecht, vario-optics ag (Switzerland); Tom K. Johansen, Technical Univ. of Denmark (Denmark); Romain Hersent, III-V Lab. (France); Haik Mardoyan, Nokia Bell Labs (France); Stefanos Dris, VPIphotonics GmbH (Germany); Theoni Alexoudi, Aristotle Univ. of Thessaloniki (Greece); Pietro G. Giardina, Nextworks s.r.l. (Italy); Diego Roccato, TelecomitaliaLAB (Italy); Garrie Vickers, Optocap Ltd. (United Kingdom); Hercules Avramopoulos, National Technical Univ. of Athens (Greece)
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Wednesday 6 February Show All Abstracts
Session 4:
Optical Interconnect Systems I
Wednesday 6 February 2019
8:00 AM - 9:40 AM
Fast optical switching technologies for inter-/intra-datacenter networks (Invited Paper)
Paper 10924-15
Author(s): Yusuke Muranaka, Salah Ibrahim, Tatsushi Nakahara, Hiroshi Ishikawa, Yohei Sakamaki, Toshikazu Hashimoto, NTT Device Technology Labs. (Japan)
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Information processing via photonic routing: residue number system arithmetic and reconfigurable graph processors (Invited Paper)
Paper 10924-16
Author(s): Volker J. Sorger, Jiaxin Peng, Shuai Sun, The George Washington Univ. (United States); Jonathan George, The George Washington Univ. (United States); Yousra Alkabani, Tarek El-Ghazawi, The George Washington Univ. (United States)
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Automated logic synthesis for electro-optic computing in integrated photonics
Paper 10924-17
Author(s): Zhoufeng Ying, Zheng Zhao, Chenghao Feng, Rohan Mital, Shounak Dhar, David Z. Pan, Ray T. Chen, The Univ. of Texas at Austin (United States)
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Modular test system for high-speed silicon photonics transceivers
Paper 10924-18
Author(s): Richard C. A. Pitwon, Liam O'Faolain, Univ. of St. Andrews (United Kingdom)
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Session 5:
Novel Optical Waveguide and Interconnect Technologies
Wednesday 6 February 2019
10:10 AM - 12:20 PM
Polymer optical interconnects for silicon and silicon-nitride photonics (Invited Paper)
Paper 10924-19
Author(s): Robert A. Norwood, College of Optical Sciences, The Univ. of Arizona (United States)
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3D-nanoprinting for photonic integration: from lab to fab (Invited Paper)
Paper 10924-20
Author(s): Philipp-Immanuel Dietrich, Karlsruher Institut für Technologie (Germany), Vanguard Photonics GmbH (Germany); Muhammad Billah, Matthias Blaicher, Tobias Hoose, Mareike Trappen, Yilin Xu, Wolfgang Freude, Karlsruher Institut für Technologie (Germany); Christian Koos, Karlsruher Institut für Technologie (Germany), Vanguard Photonics GmbH (Germany)
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Polymer optical interconnects based on hot embossing technique (Invited Paper)
Paper 10924-21
Author(s): Tianhong Cui, Univ. of Minnesota, Twin Cities (United States)
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SiN-assisted Polymer-to-SiPh adiabatic coupler optimization
Paper 10924-22
Author(s): Ioannis Poulopoulos, National Technical Univ. of Athens (Greece); Dimitrios Kalavrouziotis, Mellanox Technologies, Ltd. (Israel); Dimitrios Apostolopoulos, Hercules Avramopoulos, National Technical Univ. of Athens (Greece)
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Evaluation of the coupling performance and long-term stability of aerosol-jet-printed and photolithographic-manufactured waveguides for asymmetric optical bus couplers
Paper 10924-23
Author(s): Lukas Lorenz, Lennard Ott, Krzysztof Nieweglowski, TU Dresden (Germany); Thomas Reitberger, Friedrich-Alexander-Univ. Erlangen-Nürnberg (Germany); Jörg Franke, Friedrich-Alexander-Univ. Erlangen-Nurnberg (Germany); Karlheinz Bock, TU Dresden (Germany)
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Lunch/Exhibition Break 12:20 PM - 1:50 PM
Session 6:
Nanophotonics for Optical Interconnects
Wednesday 6 February 2019
1:50 PM - 4:00 PM
Printed photonic crystal surface-emitting membrane lasers for 3D integrated photonics (Invited Paper)
Paper 10924-24
Author(s): Weidong Zhou, The Univ. of Texas at Arlington (United States)
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High-speed VCSEL photonics for optical interconnects (Invited Paper)
Paper 10924-25
Author(s): Fumio Koyama, Xiaodong Gu, Tokyo Institute of Technology (Japan)
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Transfer of information using surface-plasmon-polariton waves
Paper 10924-26
Author(s): Rajan Agrahari, Indian Institute of Technology (BHU), Vanansi (India); Pradip Kumar Jain, Indian Institute of Technology (BHU), Vanansi (India), National Institute of Technology, Patna (India); Akhlesh Lakhtakia, The Pennsylvania State Univ. (United States)
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Electrically-driven tunable TCC-VCSEL for photonic integrated circuits
Paper 10924-27
Author(s): Hamed Dalir, Omega Optics, Inc. (United States); Mohammad Hosain Teimourpour, College of Optical Sciences, The Univ. of Arizona (United States); Elham Heidari, The Univ. of Texas at Austin (United States); Hamidreza Ramezani, The Univ. of Texas Rio Grande Valley (United States); Ray T. Chen, The Univ. of Texas at Austin (United States)
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Dielectric metamaterial waveguide for optical interconnect and sensing (Invited Paper)
Paper 10924-28
Author(s): Xiaochuan Xu, Omega Optics, Inc. (United States); Zeyu Pan, Chi-Jui Chung, Ching-Wen Chang, Hai Yan, Ray T. Chen, The Univ. of Texas at Austin (United States)
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Session 7:
Fiber Optics and Micro-Optics Integration
Wednesday 6 February 2019
4:30 PM - 6:10 PM
3D laser direct writing for advanced photonic integration in optical communications (Invited Paper)
Paper 10924-29
Author(s): Nicholas D. Psaila, Optoscribe Ltd. (United Kingdom)
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Automated assembly of 127μm pitched multichannel PM-fiber connectors
Paper 10924-30
Author(s): Tobias Müller, AIXEMTEC GmbH (Germany), Fraunhofer-Institut für Produktionstechnologie IPT (Germany); Daniel Zontar, Christian Brecher, Fraunhofer-Institut für Produktionstechnologie IPT (Germany)
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Fiber-coupled photonic interconnects based on stacked glass block connectors
Paper 10924-31
Author(s): Vanessa Zamora Gómez, Henning Schröder, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany); Sebastian Marx, Technische Univ. Berlin (Germany); Jonas Herter, Wojciech Lewoczko-Adamczyk, Martin Schneider-Ramelow, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
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Solder-reflowable single-mode fiber array photonics assembly in high-throughput manufacturing facilities (Invited Paper)
Paper 10924-32
Author(s): Alexander Janta-Polczynski, Elaine Cyr, Richard Langlois, Paul Fortier, IBM Canada Ltd. (Canada); Yoichi Taira, IBM Thomas J. Watson Research Ctr. (United States); Nicolas Boyer, IBM Canada Ltd. (Canada); Tymon Barwicz, IBM Thomas J. Watson Research Ctr. (United States)
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Session PWed:
Posters-Wednesday
Wednesday 6 February 2019
6:00 PM - 8:00 PM

Conference attendees are invited to attend the OPTO poster session on Wednesday evening. Come view the posters, enjoy light refreshments, ask questions, and network with colleagues in your field. Authors of poster papers will be present to answer questions concerning their papers. Attendees are required to wear their conference registration badges to the poster sessions. Poster authors, view poster presentation guidelines and set-up instructions at http://spie.org/PWPosterGuidelines.
Non-Hermitian engineered single-mode laser array
Paper 10924-43
Author(s): Mohammad Hosain Teimourpour, College of Optical Sciences, The Univ. of Arizona (United States); Elham Heidari, The Univ. of Texas at Austin (United States); Hamed Dalir, Omega Optics, Inc. (United States); Volker J. Sorger, The George Washington Univ. (United States); Ray T. Chen, The Univ. of Texas at Austin (United States)
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Ultrafast graphene photonics for futuristic generation of datacoms
Paper 10924-44
Author(s): Elham Heidari, The Univ. of Texas at Austin (United States); Hamed Dalir, Omega Optics, Inc. (United States); Volker J. Sorger, The George Washington Univ. (United States); Vahid Esfandyarpour, Stanford Univ. (United States); Ray T. Chen, The Univ. of Texas at Austin (United States)
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Wireless link evaluation of dielectric resonator nanoantennas
Paper 10924-45
Author(s): Gilliard N. Malheiros-Silveira, Univ. Estadual Paulista "Júlio de Mesquita Filho" (Brazil); Hugo E. Hernández-Figueroa, Univ. Estadual de Campinas (Brazil)
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Thursday 7 February Show All Abstracts
Session 8:
PICs for Optical Interconnects
Thursday 7 February 2019
8:00 AM - 10:30 AM
Monolithic silicon photonic CWDM transceivers (Invited Paper)
Paper 10924-33
Author(s): Jessie Rosenberg, IBM Thomas J. Watson Research Ctr. (United States)
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Scalable integration of BaTiO3 in silicon photonics for pockels-based electro-optic modulators (Invited Paper)
Paper 10924-34
Author(s): Felix Eltes, Daniele Caimi, Jean Fompeyrine, Stefan Abel, IBM Research - Zürich (Switzerland)
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MOICANA: monolithic cointegration of QD-based InP on SiN as a versatile platform for the demonstration of high-performance and low-cost PIC transmitters (Invited Paper)
Paper 10924-35
Author(s): Konstantinos Vyrsokinos, Dimitrios Chatzitheocharis, Marios Papadovasilakis, Dimitra Ketzaki, Aristotle Univ. of Thessaloniki (Greece); Cosimo Calo, Cristophe Caillaud, III-V Lab. (France); Davide Sacchetto, Michael Zervas, LiGenTec SA (Switzerland); Johann Peter Reithmaier, Vitalii Sichkovskyi, Univ. Kassel (Germany); Gadi Eisenstein, Meir Orenstein, Technion-Israel Institute of Technology (Israel); Benjamin Wohlfeil, Gilda Mehrpoor, ADVA AG Optical Networking (Germany); Elad Mentovich, Dimitrios Kalavrouziotis, Mellanox Technologies, Ltd. (Israel); Marco A. Garcia, Alberto Hinojosa, VLC Photonics (Spain)
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High-speed energy-efficient InP photonic integrated circuit tranceivers (Invited Paper)
Paper 10924-36
Author(s): Kevin A. Williams, Technische Univ. Eindhoven (Netherlands)
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Generation and recombination of free carriers in silicon nano-waveguides (Invited Paper)
Paper 10924-37
Author(s): Paulo Dainese, Corning Research and Development Corp. (United States); Ivan Aldaya, Andrés Gil-Molina, Lucas H. Gabrielli, Univ. Estadual de Campinas (Brazil); Hugo L. Fragnito, Univ. Presbiteriana Mackenzie (Brazil)
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Session 9:
Hybrid Device Integration Approaches for Silicon Photonic Chips
Thursday 7 February 2019
11:00 AM - 1:10 PM
Development of scalable optical packaging for integrated photonics (Invited Paper)
Paper 10924-38
Author(s): Peter O'Brien, Tyndall National Institute (Ireland)
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Unidirectional data center interconnects enabled by the use of broken-symmetry gap plasmon resonators
Paper 10924-39
Author(s): Bogdan Sirbu, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany); Jean-Claude Weeber, Alain Dereux, Laurent Markey, Univ. de Bourgogne (France), CNRS (France); Tolga Tekin, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
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Problems, challenges, and a critical survey on automated silicon photonics packaging and optical interconnection (Invited Paper)
Paper 10924-40
Author(s): Giovan Battista Preve, INPHOTEC (Italy)
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Backside optical I/O module for Si photonics integrated with electrical ICs using fan-out wafer-level packaging technology (Invited Paper)
Paper 10924-41
Author(s): Hiroshi Uemura, Kaori Warabi, Kazuya Ohira, Yoichiro Kurita, Hideto Furuyama, Photonics Electronics Technology Research Association (Japan), Toshiba Corp. (Japan); Yoshiaki Sugizaki, Hideki Shibata, Toshiba Corp. (Japan)
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Polarization-insensitive angled 3D glass-to-silicon photonics coupler
Paper 10924-42
Author(s): Ioannis Poulopoulos, National Technical Univ. of Athens (Greece); Dimitrios Kalavrouziotis, Mellanox Technologies, Ltd. (Israel); Nicholas D. Psaila, Optoscribe Ltd. (United Kingdom); Dimitrios Apostolopoulos, Hercules Avramopoulos, National Technical Univ. of Athens (Greece)
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