Call for papers is open!
Abstracts due 17 July
25 - 30 January 2025
San Francisco, California, US
Papers are solicited in the following areas:

PIC integration and optical coupling Parallel optical link module technologies Optical communications, sensing, and computing in next-generation systems Micro-optic assembly and hybrid photonic microsystem manufacturing Substrate-based optical interconnect technologies Materials for photonic packaging and interconnects ;
In progress – view active session
Conference OE204

Optical Interconnects and Packaging 2025

This conference has an open call for papers:
Abstract Due: 17 July 2024
Author Notification: 7 October 2024
Manuscript Due: 8 January 2025
Papers are solicited in the following areas:

PIC integration and optical coupling
  • silicon photonics, SiN, Ge, SiGe, III-V device integration including chiplet
  • Integrated Quantum Photonics, Quantum PIC (QPIC) Integration
  • small size and low loss waveguide-based active and passive devices
  • heterogeneous and monolithic device integration including silicon photonics
  • advances in chip-to-waveguide or chip-to-fiber coupling schemes including: grating coupler, adiabatic taper, and butt-coupling approaches
  • 2D membrane-based devices
  • photonic crystals and surface plasmonic waveguides for interconnect applications
  • new regimes involving surface plasmons or optical polaritons
  • implementation of optical interconnects in Si CMOS process compatible environment
  • measurement and testing methods for hybrid electronic/photonic assemblies
  • reliability assessment of optical interconnects, sub-systems, and electronic/photonic assemblies
  • foundry service explorations for new PDK and PAK comprehensive library formation
  • packaging density enhancement of integrated photonic devices.
Parallel optical link module technologies
  • single-mode conversion in data centers
  • data communication systems with parallel optical links and active optical cables
  • integration and packaging technologies for parallel on-board transceivers, co-packaging
  • optical bus architectures for on-board interconnects
  • ultra-low cost and ultra-low power optical links using novel laser and photodiode array components for interconnect applications
  • fiber optical connectors and coupling approaches
  • assembly and alignment of arrayed components
  • free-space parallel optical interconnect
  • mid-IR optical interconnects for free space communications and sensing
  • room temperature MidIR QCLs, QCDs, ICLs, ICDs and APDs
  • massively distributed optical interconnects suitable for neuromorphic optical computing.
Optical communications, sensing, and computing in next-generation systems
  • optical interconnect solutions and packaging for quantum communication, sensing, and quantum computing
  • advanced photonic integration technologies for computer-com applications
  • rack- and enclosure scale disaggregation
  • optically enabled hyperconverged infrastructures
  • multi-tier optical connectivity
  • optical packet and circuit switch technologies and architectures for data centers
  • WDM and SDM switching technologies and architectures for intra-data center interconnections
  • power-efficient optical computing for data centers
  • future demands for parallel optics in data center: inter-rack, inter-board, and inter-chip
  • digital and analog optical computing
  • neuromorphic optical computing
  • error reduction of AI/ML using optical interconnects and computing
  • latency and power reductions in optical computing
  • system miniaturization for quantum computing, communication, and sensing.
Micro-optic assembly and hybrid photonic microsystem manufacturing
  • micro-optic component assemblies and integrated micro-optics
  • 3D optical routing and assembly of coupling elements
  • new connectors and novel light coupling approaches
  • quantum sensor integration, NV cells, and atom trap devices
  • prototyping for advanced interconnect fabrication
  • new fiber optical integration/coupling/connectorization techniques
  • fiber handling
  • advanced micro–optic components, holograms, gratings, and aspherical lenses
  • reflective, refractive, and diffractive micro-optic elements and micro-optical systems
  • active optical alignment and assembly automation
  • passive micro-optic alignment techniques
  • metamaterial for innovative micro- and nano-optical components
  • solder reflow compatible connectivity
  • interconnect reliability, qualification, and test
  • multimode fiber for single mode optical biosensing systems including coronavirus detection.
Substrate-based optical interconnect technologies
  • photonic substrate packaging and embedding for optoelectronic and micro-optical components
  • optical interconnect design and system architectures, end-to-end link modelling and simulation
  • electronic/photonic printed circuit boards and optical backplanes, panel level integration of photonics
  • planar optical waveguide, substrate guided, flexible, lay-in fiber, and free space optical interconnects
  • machine-to-machine, board-to-board, chip-to-chip, intra-chip optical interconnects
  • silicon/glass/silicon nitride/polymer based photonic interposer
  • heterogeneous integration on chip/chipled-level using photonic short reach interconnects (polymer/glass/SiN)
  • trends in ultra-short reach optical links
  • additive manufacturing and 3D-writing of optical interconnects
  • laser structuring of optical waveguides and interfaces in glass and polymer.
Materials for photonic packaging and interconnects
  • advanced photonics packaging materials
  • thin glass for board, modules, and panel-level-packaging
  • polymers and organic/inorganic hybrid materials for optical interconnects
  • novel nanostructures and nanotechnologies for optical interconnects
  • structured fibers, multicore fibers and other novel optical fibers
  • integrated meta-material applications
  • nanomaterials and applications
  • novel bonding materials and processes
  • meta material for photonic packaging and interconnects.
Conference Chair
The Univ. of Texas at Austin (United States)
Conference Chair
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM (Germany)
Program Committee
US Conec Ltd. (United States)
Program Committee
Brilliance B.V. (Netherlands)
Program Committee
Univ. of Delaware (United States)
Program Committee
ThinkMade Engineering & Consulting (Germany)
Program Committee
TTM Technologies, Inc. (Finland)
Program Committee
Keio Univ. (Japan)
Program Committee
Nanjing Univ. (China)
Program Committee
VTT Technical Research Ctr. of Finland Ltd. (Finland)
Program Committee
The Ohio State Univ. (United States)
Program Committee
OST – Ostschweizer Fachhochschule (Switzerland)
Program Committee
EPIGAP OSA Photonics GmbH (Germany)
Program Committee
AEMtec GmbH (Germany)
Program Committee
Michigan Technological Univ. (United States)
Program Committee
Tyndall National Institute (Ireland)
Program Committee
KAIST (Korea, Republic of)
Program Committee
Aristotle Univ. of Thessaloniki (Greece)
Program Committee
Resolute Photonics Ltd. (Ireland)
Program Committee
ficonTEC Service GmbH (Germany)
Program Committee
Oregon State Univ. (United States)
Program Committee
Nanoscribe GmbH & Co. KG (Germany)
Program Committee
Optoelectronics Research Ctr. (United Kingdom)
Program Committee
AUCCEPT Consulting (Germany)
Program Committee
Baylor Univ. (United States)
Program Committee
Univ. of Cambridge (United Kingdom)
Program Committee
Chris Q. Wu
Corning Incorporated (United States)
Program Committee
ShanghaiTech Univ. (China)
Additional Information

View call for papers

What you will need to submit

  • Presentation title
  • Author(s) information
  • Speaker biography (1000-character max including spaces)
  • Abstract for technical review (200-300 words; text only)
  • Summary of abstract for display in the program (50-150 words; text only)
  • Keywords used in search for your paper (optional)
Note: Only original material should be submitted. Commercial papers, papers with no new research/development content, and papers with proprietary restrictions will not be accepted for presentation.