The Moscone Center
San Francisco, California, United States
2 - 7 February 2019
Conference OE113
Optical Interconnects XIX
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Abstract Due:
25 July 2018

Author Notification:
1 October 2018

Manuscript Due Date:
9 January 2019

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Conference Chairs
  • Henning Schröder, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
  • Ray T. Chen, The Univ. of Texas at Austin (United States)

Program Committee
  • Maggie Yihong Chen, Texas State Univ. (United States)
  • Darrell Childers, US Conec Ltd. (United States)
  • Hamed Dalir, Omega Optics, Inc. (United States)
  • Alan F. Evans, Corning Incorporated (United States)
  • Ruth Houbertz, Multiphoton Optics GmbH (Germany)
  • Marika P. Immonen, TTM Technologies, Inc. (Finland)
  • Takaaki Ishigure, Keio Univ. (Japan)
  • Mikko Karppinen, VTT Technical Research Ctr. of Finland Ltd. (Finland)
  • Christian Koos, Karlsruher Institut für Technologie (Germany)
  • Tobias Lamprecht, vario-optics ag (Switzerland)
  • Matthias Lorenz, AEMtec GmbH (Germany)

Program Committee continued...
Call for
Papers are solicited in the following areas:

Optical interconnect technologies
  • optical interconnect design and system architectures, end-to-end link modelling and simulation
  • electronic/photonic printed circuit boards and optical backplanes, panel level integration of photonics
  • optical waveguide, substrate guided, lay-in fiber and free space optical interconnects
  • machine-to-machine, board-to-board, chip-to-chip, intra-chip optical interconnects
  • glass made photonic interposer
  • trends in ultra-short reach optical links
  • high-speed and near-IR vertical-cavity surface-emitting lasers.
Nanophotonics integration and optical coupling
  • Si, Ge, SiGe, III-V device integration
  • small size and low loss waveguide-based active and passive devices
  • advances in chip-to-waveguide or chip-to-fiber coupling schemes including: grating coupler, adiabatic taper and butt-coupling approaches
  • subwavelength gratings for on-chip interconnect applications
  • 2D membrane-based devices
  • photonic crystals and surface plasmonic waveguides for interconnect applications
  • new regimes involving surface plasmons or optical polaritons
  • implementation of optical interconnects in Si CMOS process compatible environment
  • measurement and testing methods for hybrid electronic/photonic assemblies
  • reliability assessment of optical interconnects, sub-systems and electronic/photonic assemblies.
Parallel optical link technologies and active optical cables
  • data communication systems with parallel optical links and active optical cables
  • integration and packaging technologies for parallel on-board transceivers
  • parallel optical engines for on-board data communication
  • optical bus architectures for on-board interconnects
  • ultra-low cost and ultra-low power optical links using novel laser and photodiode array components for interconnect applications
  • assembly and alignment of arrayed components
  • free-space parallel optical interconnect.
Optical communication and computing in next generation data centers
  • optical interconnect solutions for rack- and enclosure scale disaggregation
  • optically enabled hyperconverged infrastructures
  • multi-tier optical connectivity
  • optical packet and circuit switch technologies and architectures for data centers
  • WDM and SDM switching technologies and architectures for intra-data center interconnections
  • power-efficient optical computing for data centers
  • photonic integration technologies for computercom applications
  • future demands for parallel optics in data center: inter-rack, inter-board and inter-chip
  • implementation timeline for integrated photonics, roadmapping.
Micro-optic assembly and photonic integration technologies
  • micro-optic component assemblies and integrated micro-optics
  • heterogeneous and monolithic device integration including silicon photonics
  • 3D optical routing and assembly of coupling elements
  • new connectors and novel light coupling approaches
  • prototyping for advanced interconnect fabrication
  • new fiber optical integration/coupling/connectorization techniques
  • fiber handling
  • reflective, refractive and diffractive micro-optic elements and micro-optical systems
  • active optical alignment and assembly automation
  • passive micro-optic alignment techniques
  • solder reflow compatible connectivity
  • interconnect reliability, qualification and test.
Materials for packaging and interconnects
  • advanced photonics packaging materials
  • thin glass for board, modules and panel-level-packaging
  • polymers and organic/inorganic hybrid materials for optical interconnects
  • novel nanostructures and nanotechnologies for optical interconnects
  • AuSn bonding for flip-chip with highest precision
  • structured fibers, multicore fibers and other novel optical fibers
  • nanomaterials and applications
  • novel bonding materials and processes.
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