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Conference OE204
Optical Interconnects and Packaging 2025
This conference has an open call for papers:
Abstract Due: 17 July 2024
Manuscript Due: 8 January 2025
Papers are solicited in the following areas:
PIC integration and optical coupling
PIC integration and optical coupling
- silicon photonics, SiN, Ge, SiGe, III-V device integration including chiplet
- Integrated Quantum Photonics, Quantum PIC (QPIC) Integration
- small size and low loss waveguide-based active and passive devices
- heterogeneous and monolithic device integration including silicon photonics
- advances in chip-to-waveguide or chip-to-fiber coupling schemes including: grating coupler, adiabatic taper, and butt-coupling approaches
- 2D membrane-based devices
- photonic crystals and surface plasmonic waveguides for interconnect applications
- new regimes involving surface plasmons or optical polaritons
- implementation of optical interconnects in Si CMOS process compatible environment
- measurement and testing methods for hybrid electronic/photonic assemblies
- reliability assessment of optical interconnects, sub-systems, and electronic/photonic assemblies
- foundry service explorations for new PDK and PAK comprehensive library formation
- packaging density enhancement of integrated photonic devices.
- single-mode conversion in data centers
- data communication systems with parallel optical links and active optical cables
- integration and packaging technologies for parallel on-board transceivers, co-packaging
- optical bus architectures for on-board interconnects
- ultra-low cost and ultra-low power optical links using novel laser and photodiode array components for interconnect applications
- fiber optical connectors and coupling approaches
- assembly and alignment of arrayed components
- free-space parallel optical interconnect
- mid-IR optical interconnects for free space communications and sensing
- room temperature MidIR QCLs, QCDs, ICLs, ICDs and APDs
- massively distributed optical interconnects suitable for neuromorphic optical computing.
- optical interconnect solutions and packaging for quantum communication, sensing, and quantum computing
- advanced photonic integration technologies for computer-com applications
- rack- and enclosure scale disaggregation
- optically enabled hyperconverged infrastructures
- multi-tier optical connectivity
- optical packet and circuit switch technologies and architectures for data centers
- WDM and SDM switching technologies and architectures for intra-data center interconnections
- power-efficient optical computing for data centers
- future demands for parallel optics in data center: inter-rack, inter-board, and inter-chip
- digital and analog optical computing
- neuromorphic optical computing
- error reduction of AI/ML using optical interconnects and computing
- latency and power reductions in optical computing
- system miniaturization for quantum computing, communication, and sensing.
- micro-optic component assemblies and integrated micro-optics
- 3D optical routing and assembly of coupling elements
- new connectors and novel light coupling approaches
- quantum sensor integration, NV cells, and atom trap devices
- prototyping for advanced interconnect fabrication
- new fiber optical integration/coupling/connectorization techniques
- fiber handling
- advanced micro–optic components, holograms, gratings, and aspherical lenses
- reflective, refractive, and diffractive micro-optic elements and micro-optical systems
- active optical alignment and assembly automation
- passive micro-optic alignment techniques
- metamaterial for innovative micro- and nano-optical components
- solder reflow compatible connectivity
- interconnect reliability, qualification, and test
- multimode fiber for single mode optical biosensing systems including coronavirus detection.
- photonic substrate packaging and embedding for optoelectronic and micro-optical components
- optical interconnect design and system architectures, end-to-end link modelling and simulation
- electronic/photonic printed circuit boards and optical backplanes, panel level integration of photonics
- planar optical waveguide, substrate guided, flexible, lay-in fiber, and free space optical interconnects
- machine-to-machine, board-to-board, chip-to-chip, intra-chip optical interconnects
- silicon/glass/silicon nitride/polymer based photonic interposer
- heterogeneous integration on chip/chipled-level using photonic short reach interconnects (polymer/glass/SiN)
- trends in ultra-short reach optical links
- additive manufacturing and 3D-writing of optical interconnects
- laser structuring of optical waveguides and interfaces in glass and polymer.
- advanced photonics packaging materials
- thin glass for board, modules, and panel-level-packaging
- polymers and organic/inorganic hybrid materials for optical interconnects
- novel nanostructures and nanotechnologies for optical interconnects
- structured fibers, multicore fibers and other novel optical fibers
- integrated meta-material applications
- nanomaterials and applications
- novel bonding materials and processes
- meta material for photonic packaging and interconnects.
Conference Chair
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM (Germany)
Program Committee
Chris Q. Wu
Corning Incorporated (United States)
Additional Information
View call for papers
What you will need to submit
- Presentation title
- Author(s) information
- Speaker biography (1000-character max including spaces)
- Abstract for technical review (200-300 words; text only)
- Summary of abstract for display in the program (50-150 words; text only)
- Keywords used in search for your paper (optional)