The Moscone Center
San Francisco, California, United States
6 - 11 March 2021
Conference OE603
Light-Emitting Devices, Materials, and Applications XXV
Conference Committee
Important Dates
Abstract Due:
26 August 2020

Author Notification:
2 November 2020

Manuscript Due Date:
16 February 2021

Additional Conference Information
Call for
Papers
Light-emitting devices (LEDs) have been evolving as the dominant light source in mobile phones, displays, automobiles, and now also general lighting. The availability of devices emitting not only in the full visible color range including white, but also in ultraviolet and infrared, enables a variety of exciting applications.

Novel materials and device architectures combined with increasingly sophisticated manufacturing processes promise low-cost solid-state light sources with high efficiency and luminous flux. With the recent advances in efficiency, radiance, output power, and white quality, LEDs are now dominating conventional lighting technologies in virtually all areas of lighting including the huge general lighting market. Looking forward, LED technology is well positioned to disrupt other markets such as displays, automobiles, visible light communications, water and air purification, sanitization, projection, bio sensing, sensors for internet of things (IoT), and lighting for health, amenity, medical diagnostics, and urban farming.

The objective of this conference is to bring together scientists and engineers working on material and device aspects as well as manufacturing and application aspects of LEDs for illumination, information, and beyond, and to review the current state of the art, development trends, and outlooks in efficiency, spectral quality, reliability, brand new emerging applications and other relevant factors. Theoretical and experimental papers will include, but not be limited to the following areas:

UV AND DUV LEDS AND THEIR APPLICATIONS
  • LEDs for near- and deep-UV emission, including semiconductor and packaging materials and device architectures
  • applications for UV/DUV LEDs including water/air/food safety
  • identification and eradication of bacterial and viral pathogens.

NIR/IR-EMITTING LEDS
  • LEDs for near-IR and IR emission including arsenides and phosphides
  • applications for NIR/IR LEDs
  • sensors for IoT.

AUGMENTED AND VIRTUAL REALITY
  • technologies and platforms for the augmented and virtual reality (AR/VR), including wearables
  • microLEDs and small pixel size solutions including brightness and color purity
  • light emitters for 3D sensing.

LIGHT BASED SENSORS AND COMMUNICATION
  • autonomous vehicles and drones, geolocation
  • light-based support of climate-neutral and smart cities
  • LiFi, Optical Wireless Communication (OWC), and LIDAR.

LED APPLICATIONS AND SOLID-STATE LIGHTING
  • LEDs, LED modules, and LED systems for solid state lighting (SSL), including general and special lighting applications, quality of white light, phosphors and packages for SSL, and white binning
  • quality of light including spectral, spatial, and temporal aspects, human centric spectral distributions including impact on biological stimuli, etc., and metrics
  • lighting for automobiles, health, emotion, medical diagnostics, horticulture, agriculture, etc.

ELECTROLUMINESCENT SEMICONDUCTOR MATERIALS AND DEVICES FOR SSL
  • perovskites, graphene, boron nitride, transition metal dichalcogenides, and other novel materials
  • stimulated emission devices, including super-luminescent and laser diodes
  • vertical cavity surface emitting LEDs, SLEDs, and lasers.

WAVELENGTH CONVERSION MATERIALS AND COMPONENTS
  • novel down-conversion materials, including narrow-band luminescent conversion materials
  • high power density converters and solutions for phosphor “droop”
  • fundamental physics and reliability of down conversion mechanisms and devices.

TECHNOLOGIES FOR LED DESIGN AND FABRICATION
  • simulations and optimization
  • novel LED fabrication methods
  • “phosphor-less” white LEDs
  • materials, architectures, packaging and mounting technologies for high power density operation.

MEASUREMENTS AND CHARACTERIZATIONS FOR LED MATERIALS AND DEVICES
  • optical, electrical, thermal, compositional, morphological, structural, etc. properties of LEDs
  • point, line, planar, and bulk defects analyses
  • degradation mechanisms and reliability issues.

EFFICIENCY CHALLENGES IN III-NITRIDES LEDS
  • high current performance and “droop” (fundamental physics and droop-optimized structures)
  • long-wavelength progress (green, yellow and beyond)
  • low-current performance for micro-LED applications.

LED MANUFACTURING
  • metalorganic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE), hydride vapor phase epitaxy (HVPE) and other deposition technologies
  • LED packaging and processing (etching, bonding, patterning, novel processes, etc.)
  • artificial intelligence (AI) and machine learning (ML) for advanced manufacturing.

SUBSTRATES FOR LED EPITAXIAL GROWTH
  • LEDs on non-sapphire crystalline substrates, including silicon, GaN, Ga2O3, etc.
  • LEDs on large area substrates including metal foils, glass, plastic, etc.

SUBMOUNTS FOR LED MOUNTING
  • LEDs on large area, low cost submounts including metal foils, glass, plastic, etc.
  • submounts for extremely high power density emitters
  • submounts for (driver/sensor-) integrated, smart, and multi-pixel or matrix devices.

QUANTUM DOT BASED LEDS
  • both photo-injected and electrically injected quantum-dot based light-emitting devices for applications to displays and illumination, among others
  • quantum dots for down-conversion of pixelated microLED arrays.

NANOMATERIALS AND NANOSTRUCTURES FOR LEDS
  • nanowires, quantum dots, and low-dimensional structures
  • photonic crystals and surface plasmons
  • nano-phosphors for display and illumination applications, including microLEDs.
Conference Committee
Conference Chairs
Program Committee
Program Committee continued...
  • Soo Min Lee, Veeco Compound Semiconductor Inc. (United States)
  • Yun-Li Li, PlayNitride Inc. (Taiwan)
  • Tien-Chang Lu, National Chiao Tung Univ. (Taiwan)
  • Koh Matsumoto, Taiyo Nippon Sanso Corp. (Japan)
  • Matteo Meneghini, Univ. degli Studi di Padova (Italy)
  • Klaus P. Streubel, OSRAM GmbH (United States)
  • Tetsuya Takeuchi, Meijo Univ. (Japan)
  • Rie Togashi, Sophia Univ. (Japan)
  • Li-Wei Tu, National Sun Yat-Sen Univ. (Taiwan)
  • Marie Anne van de Haar, Seaborough Research B.V. (Netherlands)
  • Dong-Sing Wuu, National Chung Hsing Univ. (Taiwan)
  • Erin C. Young, Apple Inc. (United States)

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