The aim of this conference is to bring together scientists and engineers working on laser-based processes at micro- and nanometer scales for advanced applications. Cutting-edge technological visions and applications are increasingly based on micro- and nano-system technologies. The realization of such devices or functional prototypes is often a new challenge for patterning, structuring, surface modification, and the productivity upscaling of the respective process. Scientists and engineers are increasingly confronted with tasks that cannot be accomplished with conventional tools.

Demands in high-tech industries are growing for specialized prototypes and high-throughput devices with micro- and nanoscaled structures, including fluidic, biologic, chemical, electronic, mechanical, or photonic features. Functional and multiscale materials increasingly coexist with micromaterials and microstructuring technologies, leading not only to new applications and research fields but also to new challenges for appropriate assembly and processing technologies. Hereby, artificial intelligence, machine learning and data-driven optimization will play an increasing role in the development of advanced and economic laser materials processing.

Laser-assisted applications emerge as an increasingly important technology which can be established in new technical approaches, in order to overcome apparent process limitations on nearly each material and for different scaling lengths. The conference LBMP is an ideal platform for scientists and engineers working on laser-based processes at micro- and nanometer scales for progressive applications. These include, photovoltaics, energy storage systems, batteries, fuel cells, displays, micro- and nanofluidic devices, which, e.g., apply modern and sophisticated beam source and beam delivery technologies, including high throughput laser processing with high-speed scanners, multi-beam configurations, roll-to-roll processing, and extensive parallel processing techniques for increasing the yield of laser processes.

Papers are solicited on the following application-oriented topics and other laser processing related issues:

Laser material processing for transparent materials, metals, polymers, ceramics, semiconductors, composites:
- laser ablation (cutting, scribing, dicing, drilling, cleaving, marking, engraving, milling, polishing) by high-power ultra-short-pulsed and/or GHz laser (kW-, mJ-class)
- laser induced selective etching
- laser surface modification in the micro- and nanometer scale by direct laser interference patterning (DLIP), laser-induced periodic surface structures (LIPSS) etc.
- laser micro-joining (welding, soldering, bonding, splicing, and sealing)
- laser transformations and modification for integrated device functionalities: annealing, curing, alloying, doping, metallization, cleaning, polymerization, sintering, cladding, bending, forming, refractive index modification, change of chemical/physical properties, and material transfer (LIFT)
- laser direct writing and micro- and nanostructuring relevant for device fabrication and processing
Laser processes for pushing green and sustainable energy solutions such as next generation energy storage devices (e.g., batteries, supercapacitors, fuel cells), photovoltaics, power-to-gas, and hydrogen technology
High-speed large-area laser processing and high-speed laser beam engineering systems, advanced adaptive optics and beam engineering methods for improving processing performance in terms of quality, yields, throughput, and resolution.
Innovative "green photonics" for micro- and nanoprocessing and assembly
Innovative approaches for optimizing the use of lasers based on AI (machine learning, predictive modelling) and data-driven optimization
Fundamental phenomena in laser matter interaction, diagnostics, particle shielding, heat accumulation, physical and chemical issues in laser-based micro- and nanofabrication, 3D and intra-volume laser processing, and assembly.

Submitted abstracts may be transferred to LAMOM depending on its subject.;

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Conference LA302

Laser-based Micro- and Nanoprocessing XIX

Conference Chair

Rainer Kling

Berner Fachhochschule (Switzerland)

Conference Chair

Wilhelm Pfleging

Karlsruhe Institute of Technology (Germany)

Conference Chair

Koji Sugioka

RIKEN Ctr. for Advanced Photonics (Japan)

Program Committee

Claude Aguergaray

The Univ. of Auckland (New Zealand)

Program Committee

Antonio Ancona

Univ. degli Studi di Bari Aldo Moro (Italy)

Program Committee

Ya Cheng

Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences (China)

Program Committee

Jiyeon Choi

Korea Institute of Machinery & Materials (Korea, Republic of)

Program Committee

Francois Courvoisier

FEMTO-ST (France)

Program Committee

Martí Duocastella

Univ. de Barcelona (Spain)

Program Committee

Oliver Haupt

Coherent LaserSystems GmbH & Co. KG (Germany)

Program Committee

Miguel Holgado Bolaños

Univ. Politécnica de Madrid (Spain)

Program Committee

SeungYeon Kang

Univ. of Connecticut (United States)

Program Committee

Andrés-Fabián Lasagni

TU Dresden (Germany)

Program Committee

Yongfeng Lu

Univ. of Nebraska-Lincoln (United States)

Program Committee

Futoshi Matsumoto

Kanagawa Univ. (Japan)

Program Committee

Razvan Stoian

Lab. Hubert Curien (France)

Program Committee

Emmanuel Stratakis

Institute of Electronic Structure and Laser, Foundation for Research and Technology-Hellas (Greece)

Program Committee

Shuntaro Tani

Univ. of Tokyo (Japan)

Program Committee

Mitsuhiro Terakawa

Keio Univ. (Japan)

Program Committee

Michael J. Withford

Macquarie Univ. (Australia)

Program Committee

Xin Zhao

Clemson Univ. (United States)

Program Committee

Craig A. Zuhlke

Univ. of Nebraska-Lincoln (United States)