The aim of this conference is to bring together scientists and engineers working on laser-based processes on micro- and nanometer scales for advanced applications. Cutting-edge technological visions and applications are increasingly based on micro- and nanosystem technologies. The realization of such devices or functional prototypes is often a new challenge for patterning, structuring, surface modification, and processing. Scientists and engineers are increasingly confronted with tasks that cannot be accomplished with conventional tools.

Demands in high-tech industries are growing for specialized prototypes and high-throughput devices with micro- and nanoscaled structures, including fluidic, biologic, chemical, electronic, mechanical, or photonic features. Functional and multiscale materials increasingly coexist with micromaterials and microstructuring technologies, leading not only to new applications and research fields but also to new challenges for appropriate assembly and processing technologies.

Laser-assisted applications emerge as an increasingly important technology which can be established in new technical approaches, in order to overcome apparent process limitations on nearly each material and for different scaling lengths. The conference LBMP is an ideal platform for scientists and engineers working on laser-based processes on micro- and nanometer scales for progressive applications. These include wearables, photovoltaics, energy storage systems, batteries, fuels cells, MOEMS, MEMS/bio-MEMS, NEMS, micro- and nanofluidic devices, which, e.g., apply modern and sophisticated beam source and beam delivery technologies, including high throughput laser processing with high-speed scanners and extensive parallel processing techniques for increasing the yield of laser processes.

Papers are solicited on the following application-oriented topics and other laser processing related issues: ;
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Conference LA302

Laser-based Micro- and Nanoprocessing XVII

This conference has an open call for papers:
Abstract Due: 20 July 2022
Author Notification: 10 October 2022
Manuscript Due: 11 January 2023
The aim of this conference is to bring together scientists and engineers working on laser-based processes on micro- and nanometer scales for advanced applications. Cutting-edge technological visions and applications are increasingly based on micro- and nanosystem technologies. The realization of such devices or functional prototypes is often a new challenge for patterning, structuring, surface modification, and processing. Scientists and engineers are increasingly confronted with tasks that cannot be accomplished with conventional tools.

Demands in high-tech industries are growing for specialized prototypes and high-throughput devices with micro- and nanoscaled structures, including fluidic, biologic, chemical, electronic, mechanical, or photonic features. Functional and multiscale materials increasingly coexist with micromaterials and microstructuring technologies, leading not only to new applications and research fields but also to new challenges for appropriate assembly and processing technologies.

Laser-assisted applications emerge as an increasingly important technology which can be established in new technical approaches, in order to overcome apparent process limitations on nearly each material and for different scaling lengths. The conference LBMP is an ideal platform for scientists and engineers working on laser-based processes on micro- and nanometer scales for progressive applications. These include wearables, photovoltaics, energy storage systems, batteries, fuels cells, MOEMS, MEMS/bio-MEMS, NEMS, micro- and nanofluidic devices, which, e.g., apply modern and sophisticated beam source and beam delivery technologies, including high throughput laser processing with high-speed scanners and extensive parallel processing techniques for increasing the yield of laser processes.

Papers are solicited on the following application-oriented topics and other laser processing related issues:
  • Laser material processing for metals, polymers, ceramics, semiconductors, composites, or dissimilar materials:
    • laser ablation (cutting, scribing, dicing, drilling, cleaving, marking, engraving, milling) by high-power ultra-short-pulsed laser (kW-, mJ-class)
    • laser surface modification in the micro- and nanometer scale by direct laser interference patterning (DLIP), laser-induced periodic surface structures (LIPSS) etc.
    • laser micro-joining (welding, soldering, bonding, splicing, and sealing)
    • laser transformations and modification for integrated device functionalities (annealing, curing, alloying, doping, metallization, cleaning, polymerization, sintering, cladding, bending, forming change of chemical/physical properties, and transferring)
    • laser direct writing and micro- and nanostructuring relevant for device fabrication and processing
  • Laser processes for pushing Green Technologies such as next generation energy storage devices (e.g., batteries, supercapacitors, fuel cells), photovoltaics, power-to-gas, and hydrogen technology towards decarbonization
  • High-speed large-area laser processing and high-speed laser beam engineering systems, advanced adaptive optics and beam engineering methods for improving laser processes, yields, and throughput
  • Innovative "green photonics" for micro- and nanoprocessing and assembly
  • Innovative approaches for optimizing the use of lasers based on AI (machine learning, predictive modelling)
  • Laser processing and packaging of thin and flexible advanced electronic and photonic components (e.g., wearables)
  • Structuring, packaging, and assembling of components in microelectronic and photonic devices, microreaction technology, MOEMS, MEMS/bio-MEMS, NEMS, micro- and nanofluidic devices and analytical systems (e.g., lab-on-chip)
  • Fundamental physical and chemical issues in laser-based micro- and nanofabrication, processing, 3D laser processing, and assembly.
Conference Chair
ALPhANOV (France)
Conference Co-Chair
Tohoku Univ. (Japan)
Conference Co-Chair
Karlsruhe Institute of Technology (Germany)
Program Committee
CNR-Istituto di Fotonica e Nanotecnologie (Italy)
Program Committee
Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences (China)
Program Committee
Univ. of Science and Technology (Korea, Republic of), Korea Institute of Machinery & Materials (Korea, Republic of)
Program Committee
FEMTO-ST (France)
Program Committee
Coherent LaserSystems GmbH & Co. KG (Germany)
Program Committee
Univ. Politécnica de Madrid (Spain)
Program Committee
National Univ. of Singapore (Singapore)
Program Committee
TU Dresden (Germany)
Program Committee
Univ. of Nebraska-Lincoln (United States)
Program Committee
Futoshi Matsumoto
Kanagawa Univ. (Japan)
Program Committee
Lab. Hubert Curien (France)
Program Committee
RIKEN Ctr. for Advanced Photonics (Japan)
Program Committee
Tsinghua Univ. (China)
Program Committee
Macquarie Univ. (Australia)
Program Committee
MKS Instruments, Inc. (United States)
Additional Information
What you will need to submit
  • Title
  • Author(s) information
  • Speaker biography
  • 250-word abstract for technical review
  • 100-word summary for the program
  • Keywords used in search for your paper (optional)
Note: Only original material should be submitted. Commercial papers, papers with no new research/development content, and papers with proprietary restrictions will not be accepted for presentation.